Qorvo to participate in Advanced Packaging and Testing Forum to discuss 5G RF advanced packaging

According to MEMS Consulting, the trend of density brought about by the reduction of RF circuit boards and available antenna space has led more and more handheld device OEMs to adopt power amplifier modules and apply new technologies such as antenna sharing between LTE and WiFi.

They further note that 5G will bring increased complexity with the release of new ultra-high frequency (N77, N78, N79) radio bands. Band reallocation with dual connectivity (early bands include N41, N71, N28 and N66, with more to come) will also increase constraints on the front end. 5G NR in mmWave spectrum cannot deliver multi-gigabit speeds, which are the key USP of 5G, and therefore requires higher density in the front-end module to enable integration of the new bands.

In their view, the RF system-in-package (SiP) market can be divided into two parts: the first is the first-level packaging of various RF devices, such as chip/wafer-level filters, switches and amplifiers (including RDL, RSV and/or bumping steps); the second is the second-level SiP packaging performed at the surface mount (SMT) stage, in which various devices are assembled on the SiP substrate together with passive devices.

As an industry-leading RF supplier, Qorvo also has unique insights in this regard.

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