Phison's latest UFS2.1 chip PS8313 leads the way for flagship smartphones across generations

Phison Electronics (TPEX: 8299), a leading NAND Flash controller chip solution provider, will officially release the latest flash memory controller PS8313 that complies with the UFS 2.1 high-speed dual-channel specification at the 2017 Flash Memory Summit ( 2017 FMS) on August 8 , US time . Phison Electronics Chairman Pan Jiancheng said that PS8313 is the latest achievement of Phison Electronics ' cooperation with international 3D NAND manufacturers, and will help the next generation of smartphone flagship models enter the ultra-high-speed storage era.

The flagship models of smartphones are actively introducing technologies such as 5G high-speed mobile networks and 8K4K high-definition multi-screen streaming, and high-end memory technology specifications are quietly entering the UFS era. The UFS specification is currently gradually replacing the eMMC specification and becoming the high-speed interface standard for smartphone embedded memory and SD memory cards. The latest and more mature UFS 2.1 specification uses a faster serial interface to meet higher data transmission rates and supports high-specification technologies such as full-duplex signal interfaces. Its bandwidth has far exceeded the traditional eMMC 5.1 . Therefore, UFS 2.1 has become a new specification currently introduced and supported by flagship smartphone chip design manufacturers such as Qualcomm and HiSilicon , and is also the preferred technology for the storage design of next-generation flagship models by various international mobile phone brands.

After Phison Electronics has achieved a high market share in the eMMC market, with the rapid upgrading of technology, it has taken the lead in developing a new flash memory controller chip PS8313 that complies with the UFS 2.1 specification and has dual channels . Ma Zhongxun, chief technology officer of Phison Electronics, pointed out, "Phison Electronics' newly launched PS8313 complies with the UFS 2.1 specification. In addition to emphasizing that it can support the platforms of various flagship mobile phone chip manufacturers, PS8313 can achieve powerful SSD- level performance through small UFS BGA packaging technology , which will help smartphone specifications to advance further and fully demonstrate Phison Electronics' all-round technical strength."

Phison Electronics' latest flash memory controller chip PS8313 uses a 28nm process and is paired with the latest 3D TLC process NAND Flash . The measured sequential read and write speeds have reached a level comparable to that of SSDs , with continuous read and write speeds of 920/550 MB/s , and random read and write speeds of 67K/62K IOPS . The measured results also reflect a performance nearly 5 times higher than the current mainstream eMMC . Through the use of Phison Electronics' original physical layer silicon intellectual property ( IP ) such as M-PHY , UniPro , and UFS , as well as Phison Electronics' fourth-generation low-power LDPC ECC error correction engine designed for the latest 3D TLC , it can support the latest 3D TLC memory from major international manufacturers, without the need for additional passive component design, which helps customers reduce design costs and improves the durability and reliability of flash memory.