Intel joins hands with ecosystem partners to showcase OPS 2.0, leading new trends in education and video conferencing technology
Recently, at the 2024 European Audiovisual Equipment and Information Systems Integrated Technology Exhibition (ISE), Intel joined hands with CVTE, a leading domestic company in education and video conferencing solutions, and Deshengda, an ODM manufacturer of embedded system solutions. Demonstrated a new generation of Intel Open Pluggable Standard (OPS) products - OPS 2.0. As a new generation of computing module carefully crafted by Intel, OPS 2.0 relies on its excellent technical advantages to not only inject new vitality into the fields of education and video conferencing, but also set a new benchmark for the entire industry.
Group photo of Intel and CVTE Group teams at the booth
The launch of the new generation OPS 2.0 is not only a reflection of our technical strength, but also our profound insight into the future trend of intelligent interaction. We believe that OPS 2.0 will bring revolutionary changes to education, conferences, medical and other industries, and promote the comprehensive upgrade of terminal functions of intelligent interactive systems. Intel will continue to work with global partners to create a smarter, more connected future.
——Lu Yingjie
Intel Networking and Edge Group
General Manager of HEC China
Group photo of Intel and Deshengda team at the booth
As education, conference, medical and other related industries have increasing expectations for the terminal functions of intelligent interactive systems, the upgrade of OPS standards has become particularly urgent to meet the growing needs of the market and achieve better adaptability. In this context, OPS 2.0 emerged as the times require, successfully solving many challenges faced by traditional OPS, such as the inability to support higher resolutions, insufficient computing power, and poor scalability.
The new generation OPS 2.0 has been optimized in many aspects:
Display output up to 8K
OPS 2.0 supports HDMI2.1 and is equipped with a new connector specification and a new generation processor, providing powerful graphics processing capabilities.
eDP interface support
OPS 2.0 supports the eDP interface, and working with the eDP panel helps simplify the hardware structure, shorten display and writing delays, simplify development work, and effectively improve user experience.
Better system design
OPS 2.0 adopts a better system design, supports Core Ultra processors, has strong heat dissipation capabilities, supports independent graphics cards, fully empowers AI, and has more powerful AI capabilities.
More high-speed IO interfaces
OPS 2.0 is equipped with more high-speed IO interfaces, including HDMI2.1, PCIE4.0 and USB3.2, which meets users' needs for multiple device connections and high-speed data transmission, providing users with more convenient and efficient data transmission and Device connection solutions.
OPS 2.0 standard design
OPS 2.0 adopts a standard design, which means it has wider compatibility and scalability.
OPS adopts an advanced pluggable design to realize the separation of computing module and display screen, providing OEM and ODM manufacturers with more flexible and efficient product development solutions. This design not only simplifies the hardware structure and reduces costs, but also greatly shortens the product development cycle and quickly meets market demand.
The new OPS 2.0 has brought revolutionary technological changes to the fields of education and video conferencing. This move not only demonstrates Intel’s leadership in technological innovation and ecological cooperation, but also reflects its determination to promote intelligent development in the education and office fields. promise. Looking forward to the future, Intel will continue to deepen cooperation with global ecological partners, expand the advanced technology and application concepts of OPS 2.0 to more fields, jointly create a new chapter of intelligent interactive technology, and lead the industry towards a broader future.
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