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Originally, due to the accuracy issues of infrared solutions for 3D facial recognition and concerns about the harm to the human body of laser solutions, the in-display fingerprint recognition technology was considered to be a more ideal biometric recognition solution for mobile devices such as smartphones.
However, it has recently faced severe challenges due to problems with the security of the recognition.
There was a rumor in the market that Samsung's new models next year might not use under-screen fingerprint recognition technology, but this has not been confirmed.
In fact, chip manufacturers and software/firmware manufacturers are currently actively looking for improvement plans and solutions to allow under-screen fingerprint recognition technology to continue to develop smoothly.
Under-screen fingerprint recognition supply chain, orders are expected to be shipped in the first half of next year
Since the design of new models for the first half of 2020 has been completed, suppliers of both optical under-screen fingerprint recognition technology and ultrasonic under-screen fingerprint recognition technology will continue to supply existing orders for new mobile phones, at least in the first half of 2020.
As for whether new models in the second half of 2020 will continue to use under-screen fingerprint recognition, it depends on whether the supply chain (including chip manufacturers, software/hardware manufacturers) has a complete solution by then.
The next generation of in-screen fingerprint recognition will be available as early as the end of this year or early next year
In addition to the two major solutions of optical under-screen fingerprint recognition and ultrasonic under-screen fingerprint recognition, panel manufacturers are also continuing to develop a newer generation of in-cell embedded under-screen fingerprint recognition technology, which can be called in-screen fingerprint recognition technology.
This in-screen fingerprint recognition solution is said to make the product screen thinner and more transparent than optical and ultrasonic in-screen fingerprint recognition, and has no size restrictions.
The current leading solution provider is China's Luoji OXI, which uses Tianma's a-Si TFT process to make TFT optical sensors. In addition, other chip manufacturers and panel manufacturers have also invested in the development of embedded under-screen fingerprint recognition technology.
The industry believes that as early as the end of 2019 or the beginning of 2020, major panel manufacturers will be the first to launch demonstration prototypes, but the specific time for mass production is still unclear.
The key to the security of under-screen fingerprint recognition lies in software and firmware applications
So what is the problem with the security of under-screen fingerprint recognition?
Is it possible for supply chain manufacturers to properly solve the problem and allow the application of under-screen fingerprint recognition technology in the mobile phone market to continue to expand its penetration rate?
From the perspective of the under-screen fingerprint recognition technology principle, the hardware part is actually only responsible for capturing the fingerprint shadow and storing the login fingerprint template in the hardware area, such as an area in the ARM core of ARM, Qualcomm, and Apple.
If they match, the App will be notified to proceed. If they do not match, the App will stay where it is and will not proceed.
Therefore, security issues are not only caused by front-end hardware fingerprint capture or comparison problems, but also by subsequent problems that occur after the comparison.
In other words, compared to the hardware part, the key to the security of under-screen fingerprint recognition lies more in the calculation firmware software and applications.
This will be an important issue that chip manufacturers and software/firmware manufacturers have no choice but to shoulder in the short term, and it is crucial to the future development pace of under-screen fingerprint recognition technology.
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
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