Official Announcement! ICDIA-IC Show 2024 Agenda Announced!
The "2024 China Integrated Circuit Design Innovation Conference and the 4th IC Application Exhibition (ICDIA-IC Show)" hosted by the China Integrated Circuit Design Innovation Alliance, Wuxi National High-tech Industrial Development Zone Management Committee, the National "Core Fire" Entrepreneurship and Innovation Base (Platform), and Xinmaitong Exhibition will be held at Wuxi Taihu International Expo Center from September 25 to 27, 2024.
Thursday, September 26, 2024
Location : Hall A4, Wuxi Taihu International Expo Center
Moderator: Cheng Jinge, Secretary General of China Integrated Circuit Design Innovation Alliance
08:35-09:05
Leader's Speech
Wafer-Scale Computing: Progress and Challenges
—Yin Shouyi , Vice Dean of the School of Integrated Circuits, Tsinghua University
AI empowers the future of mobile chips - intelligent innovation from end to cloud
—Ren Qiwei , Executive Vice President of New Tsinghua Unigroup and CEO of Unisoc
The road to embodied intelligent computing systems: collaborative innovation of algorithms and architectures
—Sun Hongbin , Vice Dean of the School of Artificial Intelligence, Xi’an Jiaotong University
Optoelectronic intelligent computing chips and systems
—Li Ming , Director of the Key Laboratory of Optoelectronic Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences
Analysis of application trend of smart home appliance chips under the new situation
—Xu Hong , Chief Engineer, China Household Electrical Appliance Research Institute
Innovative service model to enable efficient transactions
—Li Jianjun , General Manager of Electronic Components and Integrated Circuits International Trading Center Co., Ltd.
Welcome a new wave of processor chip technology and industry changes
— Bao Yungang , deputy director of the Institute of Computing Technology, Chinese Academy of Sciences
12:00-13:30 Lunch
13:25-13:30 Lucky draw (provided by Longsys)
Moderator : Professor Shi Longxing, Head of the Expert Group of China Integrated Circuit Design Innovation Alliance
Promote the upgrading of RISC-V industry and jointly build a new ecosystem of RISC-V digital infrastructure (RDI)
—He Ning , Senior Vice President and Chief Technology Officer, Beijing Eswin Computing Technology Co., Ltd.
High-speed interface IP unlocks technological breakthroughs and challenges in China's large computing industry
—Li Mengzhang , CTO of Xinyaohui Technology Co., Ltd.
Innovative computing power integrates diverse ecosystems, and Arm Technology helps smart cars race towards the AI era
— Zhao Yongchao, Head of Smart IoT and Automotive Business Line, Arm Technology
Integrated design ecosystem for chipslets and heterogeneous integration for advanced packaging
— Lihong Cao , Senior Director of Technology and Market Development at ASE
Xuantie is committed to the development and application of high-performance RISC-V CPU
— Sheng Fangwei , Senior Technical Expert of RISC-V CPU at DAMO Academy
15:10-15:40 Tea break, exhibition viewing and exchange
Based on "chips", empowering intelligent computing - Montage Technology's high-performance transportation solution
—Shangang , Vice President of Marketing , Data Center Product Department, Montage Technology Co., Ltd.
How AI is changing every aspect of EDA
—Li Liji , Global Vice President of Siemens EDA and General Manager of Technology for Asia Pacific
AI Progress in Analog Chip Design
—Lan Bijian , CEO of Suzhou Fuhu Electronic Technology Co., Ltd.
From design to sign-off, challenges and EDA solutions in the era of high-computing chips
—He Qing , CEO of Hangzhou Xingxin Technology Co., Ltd.
Discussion on the development of large-scale model-assisted chips
—Li Lei , researcher at Nanjing Institute of Intelligent Technology, Chinese Academy of Sciences
17:20-17:25 Lucky draw (provided by Longsys)
18:00-20:00 Buffet dinner
Friday, September 27, 2024
Location: Main venue, Hall A4, Wuxi Taihu International Expo Center
AI big model empowers chip design
Moderator: He Wei, Vice Chairman of China Integrated Circuit Design Innovation Alliance
RISC-V and Large Model Exploration
— Yingjie Cao , Senior Director of Chip R&D, Shanghai Time-Power Intelligent Technology Co., Ltd.
How AI big models empower EDA tools
—Guo Jiwang , deputy general manager of Beijing HuaDa Empyrean Technology Co., Ltd.
Crossing boundaries: High-speed interface IP enables efficient data flow for large AI model chips
—Wang Shangyuan , Product Marketing Director of Xinyaohui
Aixintongyuan: AI processor in the intelligent era
—Liu Jianwei , co-founder and vice president of Aixin Yuanzhi
Focusing on the semiconductor industry, cloud and AI help improve chip design and mass production efficiency
—Liu Daolong , Chief Semiconductor Industry Expert at Tencent Cloud
SerDes+UCIe: Overall solution for C2C and D2D high-speed interface IP for high-computing chips
—Jiqiang Chen , CEO of Shanghai Shenglianke Semiconductor Co., Ltd.
Technical Challenges of Advanced Process Chip Design
—Wang Chengwei , Vice President of Xi’an Unigroup Guoxin Semiconductor Co., Ltd.
AI big model empowers chip design
—Miao Liu , Senior Product Director of Cadence Electronics
Optimization and practice of simulation scheduling for large-scale chip design
—Geng Jiashen , Chief Architect of Chip Cloud Solutions at Tsinghua Unigroup Cloud Technology Co., Ltd.
12:00-12:05 Lucky Draw (provided by Longsys)
12:05-13:30 Lunch
13:25-13:30 Lucky draw (provided by Longsys)
Moderator: Xu Tao, Vice President of Unisoc (Shanghai) Technology Co., Ltd.
Taking the ISSCC/IEDM/ISCAS conference as an example, how IEEE enables AI chip innovation breakthroughs
—Li Qing , Regional Manager, IEEE Asia Pacific
Chiplets and System Integration - Key Concepts and Implementations
—Gu Xiaotian , Sales Director of Greater China at Amkor Technology
14:10-15:10
Roundtable Forum: Opportunities and Challenges of AI Chips in the Era of Big Models
Moderator: Li Lei, Researcher at Nanjing Institute of Intelligent Technology, Chinese Academy of Sciences
1. Opportunities and challenges of large models empowering AI chips
2. Realize AI-enabled application scenarios
3. China's breakthrough in AI high-computing chips
4. How to build China’s independent AI industry ecosystem
5. Implementation of edge intelligence
15:10-15:15 Lucky draw (provided by Longsys)
Friday, September 27, 2024
Location: Wuxi Taihu International Expo Center A4 Hall Branch Venue
RISC-V Ecosystem Forum
Moderator: Zhang Litian, Deputy Secretary-General of China Integrated Circuit Design Innovation Alliance
RISC-V+AI computing power ecosystem construction in the era of intelligent interconnection of all things
—Xie Tao , Peking University Chair Professor and Director of the Department of Software Science and Engineering, School of Computer Science
Complete IP platform accelerates intelligent and efficient dual engines
—Shang Lifeng , Deputy General Manager of Chengdu Ruichengxinwei Technology Co., Ltd.
Cadence Solutions Enable RISC-V Chip Innovation
—Xinwei Wu , Senior Product Manager at Cadence Electronics
High-performance RISC-V and consistent bus IP solutions
—Zhou Jie , Senior Sales Director of Guangdong Saifang Technology Co., Ltd.
High-speed interface IP, chiplets, ASIC chip customization and tape-out, one-stop shopping
—Dawei Guo , Senior Sales Director of Asia Pacific, Alphawave Semi
Securing digital verification for the RISC-V open source ecosystem
— Fan Renjun , Senior Product Manager, Shanghai Hejian Industrial Software Group Co., Ltd.
Innosilicon's full-stack custom chips and Fenghua GPU solutions
— He Ying , Head of GPU Product Line, Wuhan Xindong Holding Group Co., Ltd.
11:55-12:00 Lucky Draw (provided by Longsys)
12:00-13:30 Lunch
Friday, September 27, 2024
Location: Wuxi Taihu International Expo Center A4 Hall Branch Venue
Communication chips and RF technology
Moderator: Liu Dijun, Chairman of the Integrated Circuit Professional Committee of China Institute of Communications
13:25-13:30 Lucky draw (provided by Longsys)
High performance phase-locked loop and low jitter clock circuit
—Wu Yanhui , senior technical expert at Chongqing Southwest Integrated Circuit Design Co., Ltd.
The "small" challenges of optical modules under the background of high computing power
— Song Qingliang , Network and Communications Marketing Director, Shanghai Belling Co., Ltd.
Application based on high-performance 5G+C-V2X terminal chips
—Wang Fan , Chief Technology Officer of the Self-operated Product Center of ZTE Microelectronics Technology Co., Ltd.
Design and application of radio frequency communication integrated circuits
—Wang Zhigong , Professor, Department of Radio Engineering (School of Information Science and Engineering), Southeast University
Research Progress of Multifunctional Ultra-Wideband Radio Frequency Integrated Circuits
—Wang Yong , professor at University of Electronic Science and Technology of China
Friday, September 27, 2024
Location: Hall A5, Wuxi Taihu International Expo Center
IC Design and Strong IC Roadshow
Moderator: Chen Junning, Chairman of Anhui Semiconductor Industry Association
Starting from the core, "Linglong" multimedia solution defines a new vision for image processing
—Zhou Hua , Head of Multimedia Processor R&D at ARM Technology
Autonomous and controllable, hardware and software matching - industrial chips and ecological software
—Chen Shenggang , Hardware Technology Director, Hunan Liuyue Microelectronics Co., Ltd.
Multi-physics simulation solution for chiplet advanced packaging
—Huang Jianwei , Senior Product Engineer, Xinruiwei (Shanghai) Electronic Technology Co., Ltd.
Strong Chip China-Innovative IC Roadshow
Moderator: Chen Junning, Chairman of Anhui Semiconductor Industry Association
10:15-10:20 Lucky draw (provided by Longsys)
Haiguang's "core" height creates a new glory for China's strong core
—Zheng Chenming , General Manager of Ecological Development Center, Haiguang Information Technology Co., Ltd.
Power load sensing and control SoC chip
—Li Dejian , General Manager of Digital Chip Design Center, Beijing Zhixin Microelectronics Technology Co., Ltd.
Application of Yuefang Technology's edge intelligent chip NB2 in energy Internet of Things
— Yuan Bohu , Vice President of R&D, Guangdong Yuefang Technology Co., Ltd.
GalaxyCore 32M single-chip CIS smartphone camera solution
—Yang Shenjie , Marketing Director, GalaxyCore Inc.
From AMOLED to TFT-based Micro-LED driving technology
—Qin Liang , Executive Vice President and Chief Technology Officer of Shengxian Microelectronics (Suzhou) Co., Ltd.
Low-latency and high-quality wireless audio chip innovation
— Daxing Ma , Marketing Director of Actions Technology Co., Ltd.
12:00-13:30 Lunch
Moderator: Shen Lei, Executive Director of China Integrated Circuit Design Innovation Alliance
13:25-13:30 Lucky draw (provided by Longsys)
Vimicro Technology Ensures Video Security
— Peng Guanghui , Marketing Director, Vimicro Corporation
Longsys FORESEE LPCAMM2 helps AI to be implemented, leading the new trend of high-performance memory
—Han Xing , Product Manager of Enterprise Storage Division, Shenzhen Jiangbolong Electronics Co., Ltd.
Coolcore AR8032s: RISC-V-driven wireless communication innovation
—Wu Shenglong , Hefei Coolchip Microelectronics Co., Ltd.
SD25F201 signal conditioning and transmission chip
—Li Jian , Deputy General Manager, Hangzhou Jinghua Microelectronics Co., Ltd.
Continuous innovation path for high-performance RISC-V processor solutions
—Zhou Jie , Senior Sales Director of Guangdong Saifang Technology Co., Ltd.
From data to protection: Application of IoT energy efficiency monitoring chips
—Liao Kang , Marketing Manager, Shanghai Belling Co., Ltd.
Boosting the development of the chiplet industry - a comprehensive solution for chiplet interface circuits across process platforms
— Chong Huaming , Marketing Director of Hejian Industrial Software Group Co., Ltd.
Wireless connectivity solutions based on Sub-GHz RF transceivers
—Li Dan , Marketing and Sales Director, Chengdu Xuanjixingyuan Information Technology Co., Ltd.
15:30-16:00
Lucky draw (provided by Longsys)
Strong Chip China-Innovative IC Exhibition Exchange
*Note: The final agenda is subject to on-site announcement
Concurrent meeting agenda
AEIF 2024
2024 China Electronic Special Equipment Industry Association
Semiconductor Equipment Annual Conference
*Swipe up and down to see more
China Semiconductor Packaging and Testing Technology and Market Annual Conference
CSPT 2024
*Swipe up and down to see more
END
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