Ticket grab session | SiP China 2023 Shanghai Station: Focus on Chiplet, 2.5D/3D IC, SiP packaging industry chain opportunities

On December 13 , the 7th China System-Level Packaging Conference (SiP China 2023) Shanghai Station will be held at the Renaissance Shanghai Caohejing Hotel . As the world's major event focusing on SiP system-level packaging, after 6 years, SiP China 2023 has accumulated rich industry chain resources, sharing the stage with the world's most important experts and global high-quality suppliers, from IC design to wafer manufacturing and packaging. Extend testing to terminal applications to promote industrial integration and innovation.

Nearly 30 global heavyweight experts and business representatives will attend this conference, respectively from Amkor, Changdian Technology, SEMI, Samsung Electronics, Core and Semiconductor, VeriSilicon Microelectronics, Hanbo Semiconductor, Core Alliance Technology, and Innosilicon Technology. , Siemens EDA, Xinli Intelligent, Tuyan, Ansi Technology, Qi Moore, Xinchuangyuan, Heraeus, Ruijie Micro, Ruide Thermal, Huajin Semiconductor, Hongqi Technology, Indium Corporation, China Semiconductor Industry Association wait. Scan the QR code to get your tickets now, and don’t miss the opportunity to communicate face-to-face with industry leaders!

▼ Organizer

▼Hot topics at the conference

▼Latest schedule of the conference

▼2023 Conference Presidium/Some of the keynote speakers from the past

▼List of previous registrations and attendees