The next generation of interconnect technology is here! The 4th China Interconnect Technology and Industry Conference will be held in Shenzhen on December 7!

The 4th China Interconnect Technology and Industry Conference With the theme of "Interconnect Technology Innovation in the Era of Comprehensive Intelligence" , it focuses on the demand and challenges of computing power construction for interconnect technology driven by big models, and promotes the integrated development of industrial chain and innovation chain in the post-Moore era. The conference has a main forum: it plans to invite government leaders, academicians, investment and construction parties of intelligent computing centers, AI server companies, OEMs, chip companies, and connector companies to share around the layout of intelligent computing power construction, interconnect technology framework, hardware application scenarios, key technical challenges, and advanced solutions; and three sub-forums: key technologies for high-speed interconnection of data centers, key technologies for high-speed interconnection of intelligent connected vehicles, and key technologies for interconnection of the Internet of Things , to discuss the challenges of interconnection technology and advanced solutions. The conference plans to invite 500 industry elites from the ICT industry chain to participate.

Organizational Structure

Organizer: Wuxi Xingguang Integrated Circuit Interconnect Technology Industry Service Center, Shenzhen Connector Industry Association

Organizer: E-Trade Automotive Technology (Shanghai) Co., Ltd.

Cooperation Order Bit: Luxshare Technologies Co., Ltd.

Honorary Chairman of the Conference:

Sun Ninghui, computer system architecture expert, academician of the Chinese Academy of Engineering, researcher at the Institute of Computing Technology, Chinese Academy of Sciences, and dean of the School of Computer Science and Technology, University of Chinese Academy of Sciences

Executive Chairman of the Conference:

Hao Qinfen, Secretary General of CCITA Alliance, Researcher of Institute of Computing Technology, Chinese Academy of Sciences, and Dean of Wuxi Xinguang Interconnect Technology Research Institute

Conference Working Group:

Tang Zhong, Secretary General of Shenzhen Connector Industry Association

Li Huandong, Deputy Secretary General of Shenzhen Connector Industry Association

Shi Xiaomu, General Manager of Enmao Automotive Technology (Shanghai) Co., Ltd.

Jacky Wu, Cable & Connection International Magazine

Conference Framework & Hot Topics

(The agenda is being updated.)

8:30-12:00

✓Large model reports and publications for the connector industry

✓China's intelligent computing node layout and interconnection technology trends

✓Intelligent computing center super node ETH-X / optical interconnection

✓Application of A-PHY and SerDes chips for the new generation of smart car high-speed connection standards

✓Key technology of ultra-high-speed interconnection of Alink architecture in intelligent computing center

✓Key technologies of high-throughput Ethernet

✓Release of whole cabinet high-speed interconnection solution and sharing of key technologies

Key technologies for high-speed and high-density electrical/optical connections in data centers

13:00-18:00

✓224G high-speed interconnect technology trends in next-generation AI servers

✓Low -power AI optical interconnection Solution

✓Technical challenges of next-generation GPU sockets in AI servers

✓ Ai data center high-speed interconnection full-link solution and challenges

✓PCI-e 6.0 & 5.0 simulation and design

✓Copper alloy materials for high-speed connectors for servers

✓Signal integrity challenges and material innovations for high-speed connectors

Key technologies for high-speed interconnection of intelligent connected vehicles

13:30-18:00

✓In the era of intelligent automobiles, how do high-speed connectors adapt to new demands?

✓High-speed automotive interconnection solutions designed to adapt to the development of automotive intelligence and networking

✓HSMT public standard vehicle SerDes chip solution for intelligent cockpit vehicle display and perception

✓Domestic ASA SerDes chip

✓The new generation of vehicle-mounted SPE cables promotes the development of intelligent vehicles

✓High-speed data transmission technology and high-frequency and high-speed solutions for smart cars

Key technologies for high-speed interconnection of IoT terminals

13:30-18:00

✓ Embrace the big model and enter the era of IoT interaction innovation

✓Discussion on industrial connector interconnection technology

✓Artificial intelligence + edge computing, moving towards the intelligence of industrial Internet of Things

✓AI+Home Service Robot

✓Key interconnection technologies in AI+ smart agriculture

✓AI+Key interconnection technologies in engineering machinery equipment

✓Innovative solutions for robot control and communication systems

✓EWIS interconnection technology for aviation equipment

Review of previous sessions

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