EEWorld adds double bonus to ELEXCON Shenzhen International Electronics Exhibition and sincerely invites you to participate

Latest update time：2021-08-03

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From September 1 to 3, 2021 , the ELEXCON Shenzhen International Electronics Exhibition and Embedded System Exhibition hosted by UBM Creative will be held at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall) with the theme of "The intelligent world starts here! Towards intelligent design-advanced packaging and testing-supply chain upgrade-ecosystem".

At this year's exhibition, ELEXCON will launch a series of highlight exhibition areas:

-RISC-V Zone

-5G Technology and Internet of Vehicles Zone

-Third Generation Semiconductor/Power Supply Zone

-SiP system-level packaging and advanced packaging and testing area

-TWS & Wearable Technology Zone

-AI Chip and FPGA Zone

-AIoT technology and solutions area, etc.

Focusing on displaying cutting-edge technologies and solutions applied to consumer electronics, automobiles, industry, communications and other industries, creating an annual carnival covering Chinese electronic engineers and embedded engineers! There will be more than 600 high-quality exhibitors from home and abroad, and 20+ summit forums with different themes will be held at the same time, inviting more than 200 heavyweight experts to participate in this technical audio-visual feast of the entire industry chain of the electronics industry!

Exhibition time | September 1-3, 2021

Location | Shenzhen International Convention and Exhibition Center (Bao'an)

Scan the QR code now to pre-register for tickets and enjoy double gifts

From now until August 31, scan the QR code to pre-register for tickets and enjoy double gifts

First level pre-registration gift: 10 Jingdong cards worth RMB 50, 30 Jingdong cards worth RMB 20

Scan the QR code below and after successful pre-registration, you can participate in the lucky draw (on September 1, we will select 40 people from the registered participants to send gifts).

The second gift: EEWorld bonus

"I have a date with EEWorld" event: Pre-registered netizens During the event, go to the EEWorld booth (the booth number will be posted on the forum later) and draw a mysterious gift on the spot, 100% winning ;

Spoiler for some of the most important exhibitors, 5 recommended places to visit

Visiting direction 1: Intelligent “core” design

Main exhibition halls: Halls 5 and 7

The global chip shortage continues. This year's ELEXCON will gather many domestic and foreign IC design and electronic component and parts manufacturers with cutting-edge technologies, new products and solutions for face-to-face communication and procurement.

Exhibit Keywords

MCU/SOC/development board, RISC-V, AI chip, CPU, FPGA, embedded storage, solid-state drive, flash memory, diodes, resistors/capacitors/inductors, crystal oscillators, connectors, switches, USB, Typc-C, test and measurement, electronic components procurement platform

Visit direction 2: SiP and advanced packaging and testing

Main exhibition halls: Halls 8 and 6

With the trend of miniaturization and systematization, SiP technology has received increasing attention, and related applications have gradually expanded. On September 2-3, the well-known leadership summit created by ELEXCON: the 2021 Fifth China System-Level Packaging Conference (SiP China Shenzhen Station) will focus on the fields of smart terminals and IC manufacturing. The two-day conference will discuss 12 major topics and invite more than 40 heavyweight expert speakers.

Exhibit Keywords

SiP system-level packaging technology and advanced packaging and testing, EDA software and simulation technology, materials and processes, semiconductor equipment

Visit direction three: Smart cars

Main exhibition hall: Hall 5

Automotive-grade chips and components, wireless communication modules, 5G vehicle networking, smart cockpit, shared charging and discharging, new energy vehicles, charging piles, RF chips, antennas, and filters.

Relying on the global resources of Informa Group and working with the Internet of Vehicles Committee of the China Institute of Communications, the 2021 3rd 5G Global Conference (China Station) and 5G+C-V2X Cellular Internet of Vehicles Technology Conference (Shenzhen) will continue to be held at ELEXCON, and will create "Automotive Electronics Technology" and "5G Technology and Core Components" exhibition areas on site, as well as a complete vehicle show!

Exhibit Keywords

In the future, cars will develop in the new "five directions": electrification, intelligence, networking, sharing, and lightweight.

Visit direction 4: Smart life

Main exhibition halls: Halls 5 and 8

The world is paying attention to energy conservation and emission reduction, and all walks of life are paying more and more attention to green power generation and efficient electricity use. At the ELEXCON Shenzhen International Electronics Exhibition and Embedded System Exhibition, which will open in September, the "Fast Charging/Wireless Charging" and "Power Supply, Power Devices and Third Generation Semiconductors" exhibition areas will become a hot spot!

Exhibit Keywords

Power supply, power management chip, power device, third-generation semiconductor, fast charging/wireless charging, TWS headset and wearable technology, Bluetooth main control chip, sensor, MEMS microphone, audio chip, speaker

Visit direction 5: Smart factory

Main exhibition halls: Halls 5 and 8

In the future, factories will use a large number of automation technology equipment such as robots to improve the production capacity of smart factories and reduce labor costs. In the "Embedded System" exhibition area, companies such as Hiwin Technology, Biaopu, Jindongli, and Mingsai will display industrial robot arms, servo motors, smart logistics, electronic packaging and other equipment and solutions.

Exhibit Keywords

Industrial robots, servo motors, embedded industrial control boards, industrial tablet computers, industrial displays, industrial gateways, electronic packaging equipment, cooling fans, smart logistics

Added special features, evaluation area and engineer activities

At this year's exhibition, ELEXCON 2021 will keep up with the cutting-edge technology applications and market development hotspots, and launch a series of highlight theme exhibition areas, including: 400 square meters of wafer-level SiP advanced packaging production line display (booth number 8G08), AIoT solution area, domestic IC unicorn area, 501solutions.com solution provider area, acoustic building, TWS headset experience evaluation area, wearable solution area, shared charging and swapping area, smart cockpit experience interaction area and other special displays, more hard-core technologies, engineers are welcome to experience it at the exhibition site!

Preview of the exciting forums at the same time, taking the pulse of technology and market trends

In order to strengthen the communication between exhibitors and visitors, the exhibition site will also hold more than 20 summit forums, and it is planned to invite more than 200 expert speakers. The conference topics cover 5G Internet of Vehicles, Internet of Things, AI, SiP packaging, TWS and wearables, embedded, MCU, charging technology, power supply, connectors, smart cockpits, industrial digitalization and other hot topics.