Dialog will participate in the 2018 Bluetooth Asia Conference (Shenzhen, May 30-31)

The 2018 Bluetooth Asia Conference will be held at the Shenzhen Convention and Exhibition Center from May 30 to 31. This conference is an official event of the Bluetooth SIG and will attract more than 1,000 developers, executives and startups to gather together to inspire each other, share innovations and impart successful experiences.

As a gold sponsor of Bluetooth Asia Conference 2018, Dialog Semiconductor will be showcasing numerous Bluetooth solutions and new products, previewing upcoming development kits, and demonstrating our support for Bluetooth Mesh. Our experts will also be giving keynote speeches at the on-site developer workshops, and we sincerely invite you to attend and communicate with our experts face to face.

Developer Workshop (Forum) Speech:

Topic: Low-power sensor fusion for wearable and wireless devices

Time: May 31, 13:00-13:50

Location: Chrysanthemum Hall, 5th Floor, Shenzhen Convention and Exhibition Center

Speaker: Jelphi Zhang, Senior Manager, Application Engineering, Dialog Semiconductor

Contact: Jelphi.Zhang@diasemi.com
021-54249058

Senior Manager, Application Engineering, Dialog Semiconductor

Jelphi Zhang

Speech Abstract: “In the past decade, the miniaturization, processing power, and power efficiency of microelectronics and wireless technologies have enabled the emergence of smart devices that are small and lightweight enough to be worn on the body. Many of these devices integrate multiple sensors to sense the state of the environment on the one hand and the wearer’s vital signs and motion status on the other.

This presentation will outline how to apply smart sensor fusion algorithms to combine information from multiple sensors to derive more complex metrics that provide a better indication and more complete understanding of what is happening. It will also outline the benefits and challenges of different approaches to applying sensor fusion and why Dialog Semiconductor’s Bluetooth low energy solutions are ideal for these applications. Attendees will also have the opportunity to preview the SmartBond™ DA14585 IoT Multi-Sensor Kit.

Meanwhile, you are welcome to visit Dialog booth #36

At our booth you can:

• View our Bluetooth Mesh solutions

• See the newest members of the SmartBond™ family: DA14682 and DA14683

• Preview of the upcoming DA14585 IoT Multi-Sensor Kit

• Experience our live demos for wearables, smart home, sensors, smart tags and more

• Hear our vision for Bluetooth low energy technology

• Learn how our reference designs can accelerate your time to market

Visitors can register and visit the exhibition for free. You can click " Read original text " at the bottom left of this article to register.

If you are interested in listening to our experts' speeches, please leave a message below this article and we will provide a small number of free tickets to our customers.

Looking forward to your visit!