Samsung Foundry selects new Tempus SPICE-level precision aging analysis for high-reliability applications
Executive summary
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With Tempus SPICE-level precision aging analysis capabilities, Samsung Foundry can deliver long-term highly reliable designs while achieving better PPA results and up to 4.2% frequency improvement
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Cadence Liberate Characterization and Tempus solutions have been verified by Samsung Foundry burn-in models, allowing customers to quickly and safely complete high-reliability design signoff
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Tempus solutions’ new SPICE-level precision aging analysis capabilities help customers better complete automotive, aerospace, consumer, mobile and ultra-large-scale designs
Shanghai, China, November 17, 2021 - Cadence Electronics (Cadence, Inc., NASDAQ: CDNS) today announced that Samsung Foundry has successfully deployed the new Cadence Tempus Timing Signoff Solution, which has SPICE-level precision aging analysis capabilities. To advance automotive, aerospace, consumer, mobile and hyperscale designs. Previous aging analysis methods were mainly manual, costly and had a negative impact on power, performance and area (PPA). Applying the Tempus solution with SPICE-level precision aging analysis, Samsung successfully verified a design that is reliable for more than 10 years and improved the timing space of clock cycles by up to 10% compared to the previous method, making the PPA Results improved significantly. For information on Tempus solutions with SPICE-level precision aging analysis, please visit:
www.cadence.com/go/tempusagingpr. (Copy the URL and open it in your browser or click on the end of the article to read the original article).
Device performance degrades over time due to physical phenomena such as bias temperature instability (BTI) recovery and hot carrier injection (HCI). Technology scaling makes the problem worse, and for high-performance designs that must survive 10 years or more, timing impacts become a first-order effect. The Tempus solution provides Samsung Foundry with the best accuracy relative to SPICE, while Cadence Liberate Characterization takes stress parameters into account, reducing the burden of standard cell characterization.
“High-reliability devices require functional safety and component reliability over long operational lifetimes,” said Sangyun Kim, vice president of Samsung Electronics. “To address this challenge, Samsung and Cadence worked together to determine how to accurately Modeling time-varying component delay performance. This collaboration ensures that our aging models, including our Unified Reliability Interface (URI) model, work effectively with the SPICE-level precision aging analysis capabilities of the Liberate Characterization and Tempus solutions. Given the success of our collaborative project with Cadence, we plan to deploy the Tempus solution more broadly across a broad range of process technologies. Build innovative, reliable apps.”
“Through our collaboration, Samsung has fully realized the vision we envisioned for the new Tempus SPICE-level precision aging analysis capability—a high-reliability design with better PPA results,” said VP R&D, Digital and Signoff Group, Cadence Corporation Michael Jackson said, “In designs such as automotive, aerospace and ultra-large scale, it is crucial to maintain reliable operation for a long time. This collaboration validates that our new aging analysis method can meet customers’ reliability requirements while improving performance. Provides a real competitive advantage.”
The Tempus Timing Signoff Solution with new SPICE-level accuracy aging analysis capabilities, part of Cadence's extensive digital full flow, provides a fast design closure path and better predictability. Tempus solutions and digital full-process support the company's Intelligent System Design ™ ( Intelligent System Design ™ ) strategy to help customers achieve SoC design excellence.
About Cadence
With more than 30 years of expertise in computing software, Cadence is a key leader in the electronic design industry. Based on the company's intelligent system design strategy, Cadence is committed to providing software, hardware and IP products to help electronic design concepts become reality. Cadence's customers are the most innovative companies around the world, delivering everything from chips and circuit boards to the most dynamic application markets such as consumer electronics, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and medical. Systematic excellence in electronics. Cadence has been ranked among Fortune magazine's 100 Best Companies to Work For for seven consecutive years. For more information, please visit the company's website at cadence.com.
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