[Shanghai Offline] Tomorrow! PCB, packaging design and system SI/PI/Thermal simulation special session—2023 Cadence China Technology Tour Seminar

Latest update time：2023-12-20 17:22

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Cadence, a leading supplier in the field of electronic design automation, sincerely invites you to participate in the " 2023 Cadence China Technology Tour Seminar ". The conference will gather Cadence developers and Cadence senior technical experts, covering the most complete advanced technology exchange platform, from packaging and board level design to system analysis solutions. You'll also have the opportunity to communicate directly with the technical experts who develop Cadence tools.

Conference registration

Cadence will conduct an offline seminar on " PCB, packaging design and system SI/PI/Thermal simulation " in Shanghai .

You can scan the QR code below

Or click " Read the original text " to register for the Shanghai Station Conference

Meeting date & meeting address

Tuesday, June 20, 2023

Evergreen Laurel Hotel Shanghai

No. 1136 Zuchong Road, Pudong New Area, Shanghai

The conference is free to attend, seats are limited, so register as soon as possible!

Conference consultation:

cadence_china_marketing@cadence.com

meeting agenda

^* Agenda is subject to be changed.

The meeting is tomorrow!

Cadence is looking forward to your arrival in Shanghai!

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