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Chip News丨Zhilian An Xiamen established a subsidiary, Anda Zhixin, and planned to invest 200 million yuan

Latest update time:2024-07-18
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Daily Chip News

Issue 0718

Zhilian An Xiamen established a subsidiary, Anda Zhixin, and planned to invest 200 million yuan

According to Xiamen Torch High-tech Zone, Beijing Zhilian'an Technology Co., Ltd. recently established a subsidiary, Xiamen Anda Zhixin Technology Co., Ltd., in Xiamen Software Park Phase III, and plans to invest 200 million yuan. As Zhilian'an's southern headquarters, Anda Zhixin is its planned technology research and development center and operation center, focusing on the layout of 5G positioning chips and automotive-grade lidar chip products. The subsidiary established in Xiamen Software Park Phase III is an important part of Zhilian'an's strategic deployment of satellite communication chips. It is reported that Zhilian'an was founded in Beijing in 2013 by Tsinghua alumni Lu Yuechuan and Qian Wei. Over the past ten years, it has adhered to the technical route of self-developed core technologies of communication chips, and has successively launched heavyweight products such as NB-IoT, LTE Cat.1bis, and RedCap positioning chips.


❷Taizhou : Encourage state-owned enterprises to invest in listed/proposed listed companies, high-tech enterprises, etc.

Recently, Taizhou State-owned Assets Supervision and Administration Commission issued the "Opinions on Accelerating the High-quality Development of Taizhou State-owned Assets and State-owned Enterprises", proposing the implementation of the "Spark Plan" for capital empowerment. Deeply implement the "National Progress" action, focus on the development of the main business and industrial chain, encourage state-owned enterprises to introduce strategic investors with high matching, high recognition and high synergy, promote industrial innovation and management innovation, and achieve two-way empowerment and common development. Magnify the function of capital, leverage industrial development, increase support for the real economy and modern manufacturing industry, encourage state-owned enterprises to invest in listed companies, companies to be listed, high-tech enterprises, etc., and promote the efficient operation and circular value-added of state-owned capital.

❸Fudan University team discovered a new type of high-temperature superconductor

Titanium Media App reported on July 18 that Professor Zhao Jun's team from the Department of Physics at Fudan University successfully grew a three-layer nickel oxide La4Ni3O10 high-quality single crystal sample using high-voltage optical floating zone technology, confirming the pressure-induced bulk superconductivity in nickel oxide, with a superconducting volume fraction of 86%. The study also found that this type of material exhibits strange metal and unique interlayer coupling behavior, providing a new perspective and platform for people to understand the mechanism of high-temperature superconductivity.


❹With a total investment of approximately RMB 3 billion, a high-reliability and high-power semiconductor device IDM project was signed in Yixing

On July 16, a high-reliability and high-power semiconductor device integrated circuit IDM project with a total investment of about 3 billion yuan was officially signed in Yixing. The total investment of the high-reliability and high-power semiconductor device integrated circuit IDM project signed this time is about 3 billion yuan, of which fixed investment is about 2.2 billion yuan. It is led by Guolian Group and Jiangsu Assets, and jointly with semiconductor industry experts, Jiangsu New Era Semiconductor Co., Ltd. (preparatory) Co-Chairman Ji Gang, Liding Capital and other industrial investment institutions to register and establish a special M&A fund, complete the merger of integrated circuit wafer manufacturing and packaging testing companies and semiconductor chip agency sales companies, and set up a project company in Yixing Economic Development Zone to engage in the production of high-reliability and high-power semiconductor components and products and other businesses.



Overseas News
Korean media: SK Hynix HBM4 memory uses TSMC N5 version basic bare chip
According to the report of the Science and Technology Innovation Board Daily on the 17th, SK Hynix will use TSMC's N5 process version of the base die (BaseDie) to build HBM4 memory. SK Hynix and TSMC signed a memorandum of understanding on cooperation in April this year, announcing that they would strengthen cooperation on the base die of HBM memory. Earlier, it was reported that SK Hynix's first batch of HBM4 products (12-layer stacked version) is expected to be launched in the second half of 2025. (Korea Economic Daily)
❷The U.S. Department of Commerce reached preliminary terms with GlobalWafers, which will receive $400 million in funding
Cailian News reported on July 17 that the U.S. Department of Commerce announced on July 17 that it had signed a non-binding preliminary memorandum of terms with a subsidiary of GlobalWafers. The U.S. government will provide up to $400 million in direct funding under the Chips and Science Act to help the production of key semiconductor wafers. The U.S. Department of Commerce announcement showed that according to the investment proposal, GlobalWafers will build factories in Texas, Missouri and other places to produce 300mm silicon wafers.

Samsung Electronics will acquire British knowledge graph technology startup Oxford Semantic Technologies
Samsung Electronics announced on July 17 local time that it has agreed to acquire Oxford Semantic Technologies, a British knowledge graph technology startup, without disclosing the terms of the agreement. Samsung Electronics said Oxford Semantic Technologies focuses on knowledge graph technology, which can be used to better personalize artificial intelligence applications.
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