Chip News丨Mifee Technology received RMB 100 million in Series C financing to accelerate the global layout of AMHS

❶Mifee Technology received RMB 100 million in Series C financing to accelerate the global layout of AMHS

On July 15, Mifee Technology officially announced that it had recently completed a C round of financing of 100 million yuan, led by Volkswagen Juding and followed by Jingyou Capital. This financing will increase investment in R&D and operations, expand overseas production capacity, and help Mifee Technology accelerate the layout of semiconductor automatic material handling systems (AMHS) worldwide. Mifee Technology (Shanghai) Co., Ltd. is a supplier of semiconductor AMHS systems and core components. It focuses on the production, research and development, and sales of automatic material handling systems AMHS suitable for the entire semiconductor industry chain. It is headquartered in Shanghai. According to official news from Mifee Technology, the Chinese production and R&D base is located in the Lingang New Area of ​​Shanghai, and a standardized demonstration line of AMHS system with overhead crane as the core has been built. It is currently the largest AMHS R&D laboratory and Demo Line in China.

❷Evergrande Huaxin: Wholly-owned subsidiary plans to invest 100 million yuan to subscribe for the newly increased registered capital of Weiqing Semiconductor

On July 12, Everbright Huaxin announced that its wholly-owned subsidiary Suzhou Everbright Huaxin Semiconductor Laser Innovation Research Institute Co., Ltd. intends to invest 100 million yuan to subscribe to the newly added registered capital of 13.3333 million yuan of its affiliated company Weiqing Semiconductor. Before this capital increase, the institute held 29% of the equity of Weiqing Semiconductor. After the capital increase is completed, the institute will hold 31.61% of the equity of Weiqing Semiconductor. According to the announcement of Everbright Huaxin, in order to further improve the company's industrial layout, Everbright Huaxin's wholly-owned subsidiary Suzhou Everbright Huaxin Semiconductor Laser Innovation Research Institute Co., Ltd. and Qingchun Semiconductor (Ningbo) Co., Ltd., Suzhou Weiqing Enterprise Management Partnership (Limited Partnership), and Suzhou Zesen Deloitte Enterprise Management Partnership (Limited Partnership) jointly invested in the establishment of Weiqing Semiconductor to jointly promote the development of high-end power chip projects.

❸The second phase of the National Big Fund invested in Chongqing Xinlian Microelectronics, a specialty process wafer fab

Tianyancha shows that on July 13, Chongqing Xinlian Microelectronics Co., Ltd. underwent a number of industrial and commercial changes, among which new shareholders were Chongqing Manufacturing Transformation and Upgrading Private Equity Investment Fund Partnership (Limited Partnership) and National Integrated Circuit Industry Investment Fund Phase II Co., Ltd. After the new shareholders joined, Xinlian Microelectronics' shareholders include Chongqing High-tech Zone Intelligent Manufacturing Industry Research Institute, Chongqing Xiyong Microelectronics Industrial Park Development Co., Ltd., National Integrated Circuit Industry Investment Fund Phase II Co., Ltd., Qingling Motors (Group) Co., Ltd., and Chongqing Manufacturing Transformation and Upgrading Private Equity Investment Fund Partnership (Limited Partnership).

❹The US government announced that it will award $300 million in CHIPS Act subsidies to the first three R&D institutions

The United States announced the selection process for the first three CHIPS Act R&D institutions on July 12. Part of the bill includes funding for R&D institutions, and the U.S. government is preparing to make these awards. The planned CHIPS Act R&D facilities will help achieve this goal. The bill includes up to $11 billion in R&D funding, and the government intends to allocate up to $300 million for the first R&D facilities. Funding will be used for three R&D centers: NSTC Prototype and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Pilot Facilities, NSTC Administrative and Design Facilities, and NSTC Extreme Ultraviolet (EUV) Center.