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Daily Core News
Issue
0225
❶Intelligent
robot company Yushu Technology announced the completion of nearly 1 billion yuan in B2 round financing
The intelligent robot company Hangzhou Yushu Technology Co., Ltd. completed the B2 round of financing before the Spring Festival in 2024, raising nearly 1 billion yuan. Investors in this round include Meituan, Jinshi Investment, Source Code Capital, and old shareholders Shenzhen Venture Capital and China Online Investment , Rong Yi, Dun Hong and Mida Junshi also invested. The funds will be mainly used for product research and development, business expansion and team building. (The Paper)
❷Ultraman
responds to the US$7 trillion semiconductor plan: The world needs more investment in AI chips than imagined
Recently, it was revealed that Altman is raising a total of up to 7 trillion US dollars in funds from the Middle East to support a semiconductor plan of OpenAI and compete with Nvidia. Altman said: "This will require a lot of global investment, beyond our imagination. We don't have a specific number yet." He also emphasized the importance of accelerating the development of artificial intelligence over the past year. He believes that advances in artificial intelligence will bring a better future for mankind, but Ultraman also admits that there will be a downside to moving forward. (Financial Associated Press)
❸It
is reported that SK Hynix will start mass production of HBM3E memory in March
It is reported that SK Hynix officially ended the development of HBM3E in mid-January, successfully completed Nvidia's half-year performance evaluation, and plans to start mass production of the fifth-generation HBM3E high-bandwidth memory product in March and supply it to Nvidia next month First batch of products. (NetEase)
❹It
is rumored that the Japanese government will provide approximately 730 billion yen in subsidies for TSMC’s Kumamoto Plant II
It is reported that the Japanese government will provide approximately 730 billion yen in subsidies for TSMC’s Kumamoto Second Factory. This subsidy measure is designed to support the construction and operation of the factory to promote the development of Japan’s semiconductor industry. Previously, media reported that TSMC plans to invest up to 2 trillion yen in the Kumamoto Second Factory to further expand its chip manufacturing business in Asia, especially Japan. (Jiweiwang)
❶
"Chip Olympics" TSMC shows off its skills! Next-generation packaging technology improves AI chip performance
At ISSCC 2024, TSMC brought another new technology. TSMC has introduced a new generation of packaging technology for high-performance computing and AI chips to the outside world. Based on the existing 3D packaging, it has also integrated silicon photonics technology to improve interconnection effects and reduce power consumption. According to Zhang Xiaoqiang, senior vice president of business development at TSMC, this technology is designed to help package more HBM and Chiplet small chips, thereby improving the performance of AI chips. This packaging technology of TSMC uses silicon photonics technology to use optical fibers to replace traditional I/O circuits to transmit data. Not only that, in this packaging architecture, heterogeneous chips are stacked on top of the base chip and use hybrid bonding technology to maximize I/O performance. (Science and Technology Innovation Board Daily)
❷Xiaomi
releases self-developed Xiaomi Pascal T1 signal enhancement chip
Recently, Xiaomi Group President Lu Weibing said at a press conference that Xiaomi Mi 14 Ultra will be equipped with two Xiaomi self-developed Pengpai T1 signal enhancement chips. One of the T1 chips is enhanced for medium and high frequency communication performance, Wi-Fi and Bluetooth and other wireless communication performance, and the other T1 chip is enhanced for bidirectional satellite antenna transceiver performance. Xiaomi also launched a separate satellite signal amplifier accessory. (Financial Associated Press)
❸
Didao Microelectronics completed a new round of tens of millions of yuan in financing
Recently, Shenzhen Didao Microelectronics Technology Co., Ltd. completed a new round of tens of millions of yuan in financing. Zijingang Capital will continue to invest as the lead investor in the angel round, and the financing funds will be used for R&D investment and market operations. Didao Microelectronics was established in November 2020. Its main products are photoresists for flat panel displays, g-line, i-line, KrF, and ArF photoresists to meet the needs of large-size display panels, 90-14nm chip process photoresists, and Market demand for semiconductor specialty chemicals supporting photoresists. (Science and Technology Innovation Board Daily)
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