There are three main ways to develop products using Tuya Wi-Fi modules and Tuya Wi-FiBluetooth LE dual-mode modules:Zero-code development: Tuya provides a visual function configuration interface. No p...
introduction:The C2000 Piccolo series MCU chips generally integrate 1-2 hardware SCI (UART). Sometimes, due to cost or layout area considerations, only small packages or models with less resources can...
lamxu Differential amplifier circuitHomeEdit pageLog in HelpWelcome! What you see below is a wiki , which is a special kind of website YOU can edit! Take a tour to see what you can do, or get a wiki y...
TI ZigBee protocol stack Z-Stack has evolved from the initial Z-Stack 0.1 to the familiar Z-Stack 2.5.1a, and now to Z-Stack Home 1.2.1, Z-Stack Lighting 1.0.2, Z-Stack Energy 1.0.1, and Z-Stack Mesh ...
[size=4] What is dimension? It is usually taught in middle school physics courses and again in university physics courses. However, I am afraid that most students are still vague about dimension. [/si...
As shown in the figure below, based on the functional block diagram in the figure below, how much does it cost to build a TMR magnetoresistive switch, complete development and production?...
1.Option——Debug Select ST-Link Debugger
2. Click Setting and select SW mode
3. Select Erase Full Chip mode on the Flash Download option page and check Reset and Run. ...[Details]
A man stands in front of a wind turbine equipped with LED lights in Hanover, northern Germany, on September 5. The LED lighting installation was designed by French artist Patrick Renaud and was unv...[Details]
0 Introduction
The electric locomotive logic control unit (LCU) is an important control part of the electric locomotive. It uses modern electronic components to replace the original contac...[Details]
The Beijing R&D center of Hongjing Intelligent Driving was officially established. The R&D center is located in Wangjing Science Park, Chaoyang District, Beijing, and will become the second largest R...[Details]
According to Jiwei.com, the U.S. Department of Justice has intervened in the case in which the U.S. Federal Trade Commission (FTC) accused Qualcomm, a major mobile phone chip manufacturer, of monopol...[Details]
In the development process of set-top boxes, the development of source decoders is the foundation and core of the entire development work. With the introduction of the machine-card separation polic...[Details]
1. Overview of S3C2440 Serial Port Serial communication generally requires the addition of a level conversion circuit because the TTL/CMOS level is inconsistent with the RS232 level: TTL/CMOS level: ...[Details]
Recently, the "Three-Year Action Plan to Accelerate the Development of 5G Industry in Henan Province (2020-2022)" (hereinafter referred to as the "Action Plan") was issued, clarifying the development...[Details]
This is a plan that has been brewing for a long time and has just been made public: Hesai is going to IPO in the United States. On January 17, 2023, Hesai Technology officially submitted an F-1 doc...[Details]
Push-pull output: can output high or low level and connect digital devices; push-pull structure generally refers to two transistors that are controlled by signals from the abdomen respectively, and...[Details]
Traditional arc lamps (xenon lamps, deuterium lamps, etc.) are driven by electrodes, which limits the performance of brightness, life and stability. Laser Driven Light Source (LDLS) adopts an electro...[Details]
If the flashing of nandflash fails, or the wrong bootstrap is burned, causing the system to be unable to boot, and the sam-ba cannot be connected via USB, and there is no jlink on hand, you can try t...[Details]
After a year, the Federal Trade Commission (FTC)'s investigation into Facebook's privacy issues is about to come to an end. The Wall Street Journal believes that this will be a decisive moment that i...[Details]
LIS2DW12 is an ultra-low power 3D accelerate sensor in ST's second-generation MEMS family. It is often used in miniaturized wearable products such as rings and headphones. Among them, implanting 3D...[Details]