Last night, Cree | Wolfspeed announced that it will end its Nasdaq trading on October 1 and will officially start trading on the New York Stock Exchange on October 4 under the ticker symbol "WOLF". At the same time, the company's name will be changed from Cree, Inc. to Wolfspeed, Inc.
Cree said the transition marks an important milestone and Cree will continue to lead the industry transformation from silicon (Si) to silicon carbide (SiC).
In 2019 and 2021, Cree completed the sale of its lighting and LED businesses and completely transformed into a company focusing on wide bandgap semiconductor products. Its main businesses include the sale of substrates, epitaxial wafers, power or RF device products, and the provision of gallium nitride RF device foundry services, covering all aspects of wide bandgap semiconductors.
In 2019, Cree announced that it would invest $1 billion over five years to expand SiC and GaN production capacity in the United States, including an investment of $450 million to build an 8-inch wafer factory in Marcy, New York, and an investment of $450 million to expand and renovate a 6-inch wafer and substrate material factory in Durham, North Carolina, its headquarters, into a super substrate material factory. Another $100 million will be used for working capital.
In October of the same year, it was announced that the first batch of 8-inch SiC wafer samples had been successfully prepared at the Albany campus of the New York State Polytechnic Institute.
Cree's 8-inch SiC wafer factory began to move in equipment in April 2021 and is expected to start production in 2022. It is expected that by 2024, when it reaches full production, it will reach 30 times the capacity of 2017, and the products must meet automotive standards. Cree said that in 2024, the 8-inch SiC wafer factory will be planned to reach full production; the proportion of SiC and GaN device product business will exceed that of the material business; revenue will reach US$1.5 billion, and EBIT will be 375 million yuan.
Not long ago, Cree announced its fourth quarter financial report for fiscal year 2021 ending June 27, with revenue of US$145.8 million, a year-on-year increase of 35% and a month-on-month increase of 6%, slightly higher than analysts' expectations of US$145.17 million. Looking ahead to the next quarter, Cree's target revenue is between US$144 million and US$154 million.
Gregg Lowe, CEO of the company, said, "Strong revenue in the quarter was driven by customers ramping up production earlier and more significantly than initially expected. We continue to capture growth and conversion opportunities in our equipment segment, further establishing our leadership position in the silicon carbide industry."
Gregg Lowe further revealed that the company is on track to complete the world's largest silicon carbide plant in early 2022, enabling it to take full advantage of growth opportunities in the coming decades.
Cree previously announced that it would expand its existing long-term silicon carbide wafer supply agreement with STMicroelectronics, and Cree will supply 6-inch silicon carbide wafers to the latter in the next few years.
Previous article:The United States will hold another business summit next week to solve the chip shortage
Next article:Nanchang's integrated circuit imports in the first eight months were 15.86 billion yuan, down 17.1% year-on-year
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- BOE's new generation of light-emitting devices empowers iQOO 13 to fully lead the flexible display industry to a new level of performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- 【GD32L233C-START Review】17. Completed work: Indoor environment monitoring equipment
- [Atria AT32WB415 Series Bluetooth BLE 5.0 MCU] Part 3: Lightble Control OLED Display
- Car sunlight sensor, urgent help
- Communication Principles_matlab.pdf
- Flyback power supply saber simulation
- Fundamentals of Spectrum Analysis
- Linux/UNIX System Programming Manual (Volumes 1 and 2)
- TMS320C6000 chip structure diagram and basic characteristics
- [ESK32-360 Review] + Serial communication and applications
- EEWORLD University Hall----Live Replay: TI's new generation of low-power Bluetooth microcontrollers helps you reduce application costs