|
74LVC2G02GM |
74LVC2G02 |
74LVC2G02GT |
74LVC2G02DC |
74LVC2G02_08 |
74LVC2G02GD |
74LVC2G02DP |
Description |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Dual 2-input NOR gate |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
- |
conform to |
conform to |
Maker |
NXP |
- |
NXP |
NXP |
- |
NXP |
NXP |
Parts packaging code |
QFN |
- |
SON |
TSSOP |
- |
SON |
SOIC |
package instruction |
1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8 |
- |
1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 |
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 |
- |
3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 |
3 MM, PLASTIC, SOT505-2, TSSOP-8 |
Contacts |
8 |
- |
8 |
8 |
- |
8 |
8 |
Reach Compliance Code |
compli |
- |
compli |
compli |
- |
compli |
compli |
series |
LVC/LCX/Z |
- |
LVC/LCX/Z |
LVC/LCX/Z |
- |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
S-PQCC-N8 |
- |
R-PDSO-N8 |
R-PDSO-G8 |
- |
R-PDSO-N8 |
S-PDSO-G8 |
JESD-609 code |
e4 |
- |
e3 |
e4 |
- |
e4 |
e4 |
length |
1.6 mm |
- |
1.95 mm |
2.3 mm |
- |
3 mm |
3 mm |
Load capacitance (CL) |
50 pF |
- |
50 pF |
50 pF |
- |
50 pF |
50 pF |
Logic integrated circuit type |
NOR GATE |
- |
NOR GATE |
NOR GATE |
- |
NOR GATE |
NOR GATE |
MaximumI(ol) |
0.024 A |
- |
0.024 A |
0.024 A |
- |
0.024 A |
0.024 A |
Humidity sensitivity level |
1 |
- |
1 |
1 |
- |
1 |
1 |
Number of functions |
2 |
- |
2 |
2 |
- |
2 |
2 |
Number of entries |
2 |
- |
2 |
2 |
- |
2 |
2 |
Number of terminals |
8 |
- |
8 |
8 |
- |
8 |
8 |
Maximum operating temperature |
125 °C |
- |
125 °C |
125 °C |
- |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
- |
VSON |
VSSOP |
- |
VSON |
TSSOP |
Encapsulate equivalent code |
LCC8,.06SQ,20 |
- |
SOLCC8,.04,20 |
TSSOP8,.12,20 |
- |
SOLCC8,.11,20 |
TSSOP8,.16 |
Package shape |
SQUARE |
- |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
- |
TAPE AND REEL |
TAPE AND REEL |
- |
TAPE AND REEL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
- |
260 |
260 |
power supply |
3.3 V |
- |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
Prop。Delay @ Nom-Su |
6.2 ns |
- |
6.2 ns |
6.2 ns |
- |
6.2 ns |
6.2 ns |
propagation delay (tpd) |
11.2 ns |
- |
11.2 ns |
11.2 ns |
- |
11.2 ns |
11.2 ns |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
- |
NO |
NO |
- |
NO |
NO |
Maximum seat height |
0.5 mm |
- |
0.5 mm |
1 mm |
- |
0.5 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.65 V |
- |
1.65 V |
1.65 V |
- |
1.65 V |
1.65 V |
Nominal supply voltage (Vsup) |
3.3 V |
- |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
surface mount |
YES |
- |
YES |
YES |
- |
YES |
YES |
technology |
CMOS |
- |
CMOS |
CMOS |
- |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
NICKEL PALLADIUM GOLD |
- |
Tin (Sn) |
NICKEL PALLADIUM GOLD |
- |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
Terminal form |
NO LEAD |
- |
NO LEAD |
GULL WING |
- |
NO LEAD |
GULL WING |
Terminal pitch |
0.5 mm |
- |
0.5 mm |
0.5 mm |
- |
0.5 mm |
0.65 mm |
Terminal location |
QUAD |
- |
DUAL |
DUAL |
- |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
- |
30 |
30 |
- |
30 |
30 |
width |
1.6 mm |
- |
1 mm |
2 mm |
- |
2 mm |
3 mm |