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74LVC2G02DC

Description
Dual 2-input NOR gate
Categorylogic    logic   
File Size81KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC2G02DC Overview

Dual 2-input NOR gate

74LVC2G02DC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instruction2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Contacts8
Reach Compliance Codecompli
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNOR GATE
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su6.2 ns
propagation delay (tpd)11.2 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm

74LVC2G02DC Related Products

74LVC2G02DC 74LVC2G02 74LVC2G02GT 74LVC2G02_08 74LVC2G02GD 74LVC2G02DP 74LVC2G02GM
Description Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate
Is it Rohs certified? conform to - conform to - conform to conform to conform to
Maker NXP - NXP - NXP NXP NXP
Parts packaging code TSSOP - SON - SON SOIC QFN
package instruction 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 - 1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 - 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8
Contacts 8 - 8 - 8 8 8
Reach Compliance Code compli - compli - compli compli compli
series LVC/LCX/Z - LVC/LCX/Z - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G8 - R-PDSO-N8 - R-PDSO-N8 S-PDSO-G8 S-PQCC-N8
JESD-609 code e4 - e3 - e4 e4 e4
length 2.3 mm - 1.95 mm - 3 mm 3 mm 1.6 mm
Load capacitance (CL) 50 pF - 50 pF - 50 pF 50 pF 50 pF
Logic integrated circuit type NOR GATE - NOR GATE - NOR GATE NOR GATE NOR GATE
MaximumI(ol) 0.024 A - 0.024 A - 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 - 1 - 1 1 1
Number of functions 2 - 2 - 2 2 2
Number of entries 2 - 2 - 2 2 2
Number of terminals 8 - 8 - 8 8 8
Maximum operating temperature 125 °C - 125 °C - 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C - -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP - VSON - VSON TSSOP HVQCCN
Encapsulate equivalent code TSSOP8,.12,20 - SOLCC8,.04,20 - SOLCC8,.11,20 TSSOP8,.16 LCC8,.06SQ,20
Package shape RECTANGULAR - RECTANGULAR - RECTANGULAR SQUARE SQUARE
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing TAPE AND REEL - TAPE AND REEL - TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 - 260 - 260 260 260
power supply 3.3 V - 3.3 V - 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su 6.2 ns - 6.2 ns - 6.2 ns 6.2 ns 6.2 ns
propagation delay (tpd) 11.2 ns - 11.2 ns - 11.2 ns 11.2 ns 11.2 ns
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified
Schmitt trigger NO - NO - NO NO NO
Maximum seat height 1 mm - 0.5 mm - 0.5 mm 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V - 5.5 V - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V - 1.65 V - 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V - 3.3 V 3.3 V 3.3 V
surface mount YES - YES - YES YES YES
technology CMOS - CMOS - CMOS CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD - Tin (Sn) - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING - NO LEAD - NO LEAD GULL WING NO LEAD
Terminal pitch 0.5 mm - 0.5 mm - 0.5 mm 0.65 mm 0.5 mm
Terminal location DUAL - DUAL - DUAL DUAL QUAD
Maximum time at peak reflow temperature 30 - 30 - 30 30 30
width 2 mm - 1 mm - 2 mm 3 mm 1.6 mm
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