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74LVC2G02_08

Description
Dual 2-input NOR gate
File Size81KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74LVC2G02_08 Overview

Dual 2-input NOR gate

74LVC2G02_08 Related Products

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Description Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate Dual 2-input NOR gate
Is it Rohs certified? - - conform to conform to conform to conform to conform to
Maker - - NXP NXP NXP NXP NXP
Parts packaging code - - SON TSSOP SON SOIC QFN
package instruction - - 1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8
Contacts - - 8 8 8 8 8
Reach Compliance Code - - compli compli compli compli compli
series - - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - - R-PDSO-N8 R-PDSO-G8 R-PDSO-N8 S-PDSO-G8 S-PQCC-N8
JESD-609 code - - e3 e4 e4 e4 e4
length - - 1.95 mm 2.3 mm 3 mm 3 mm 1.6 mm
Load capacitance (CL) - - 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - - NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE
MaximumI(ol) - - 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level - - 1 1 1 1 1
Number of functions - - 2 2 2 2 2
Number of entries - - 2 2 2 2 2
Number of terminals - - 8 8 8 8 8
Maximum operating temperature - - 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - VSON VSSOP VSON TSSOP HVQCCN
Encapsulate equivalent code - - SOLCC8,.04,20 TSSOP8,.12,20 SOLCC8,.11,20 TSSOP8,.16 LCC8,.06SQ,20
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form - - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing - - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - - 260 260 260 260 260
power supply - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su - - 6.2 ns 6.2 ns 6.2 ns 6.2 ns 6.2 ns
propagation delay (tpd) - - 11.2 ns 11.2 ns 11.2 ns 11.2 ns 11.2 ns
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - - NO NO NO NO NO
Maximum seat height - - 0.5 mm 1 mm 0.5 mm 1.1 mm 0.5 mm
Maximum supply voltage (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - - 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - - YES YES YES YES YES
technology - - CMOS CMOS CMOS CMOS CMOS
Temperature level - - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - - Tin (Sn) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form - - NO LEAD GULL WING NO LEAD GULL WING NO LEAD
Terminal pitch - - 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location - - DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature - - 30 30 30 30 30
width - - 1 mm 2 mm 2 mm 3 mm 1.6 mm

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