Dual 2-input NOR gate
74LVC2G02_08 | 74LVC2G02 | 74LVC2G02GT | 74LVC2G02DC | 74LVC2G02GD | 74LVC2G02DP | 74LVC2G02GM | |
---|---|---|---|---|---|---|---|
Description | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate |
Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to | conform to |
Maker | - | - | NXP | NXP | NXP | NXP | NXP |
Parts packaging code | - | - | SON | TSSOP | SON | SOIC | QFN |
package instruction | - | - | 1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8 |
Contacts | - | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | - | compli | compli | compli | compli | compli |
series | - | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 code | - | - | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | S-PQCC-N8 |
JESD-609 code | - | - | e3 | e4 | e4 | e4 | e4 |
length | - | - | 1.95 mm | 2.3 mm | 3 mm | 3 mm | 1.6 mm |
Load capacitance (CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | - | - | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
MaximumI(ol) | - | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 | 1 |
Number of functions | - | - | 2 | 2 | 2 | 2 | 2 |
Number of entries | - | - | 2 | 2 | 2 | 2 | 2 |
Number of terminals | - | - | 8 | 8 | 8 | 8 | 8 |
Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | - | VSON | VSSOP | VSON | TSSOP | HVQCCN |
Encapsulate equivalent code | - | - | SOLCC8,.04,20 | TSSOP8,.12,20 | SOLCC8,.11,20 | TSSOP8,.16 | LCC8,.06SQ,20 |
Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
Package form | - | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
method of packing | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 | 260 | 260 |
power supply | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Su | - | - | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns |
propagation delay (tpd) | - | - | 11.2 ns | 11.2 ns | 11.2 ns | 11.2 ns | 11.2 ns |
Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | - | - | NO | NO | NO | NO | NO |
Maximum seat height | - | - | 0.5 mm | 1 mm | 0.5 mm | 1.1 mm | 0.5 mm |
Maximum supply voltage (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
Nominal supply voltage (Vsup) | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | - | - | YES | YES | YES | YES | YES |
technology | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Terminal surface | - | - | Tin (Sn) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
Terminal form | - | - | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD |
Terminal pitch | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
Terminal location | - | - | DUAL | DUAL | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 | 30 | 30 |
width | - | - | 1 mm | 2 mm | 2 mm | 3 mm | 1.6 mm |