OTP ROM, 32X8, 65ns, TTL, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Maximum access time | 65 ns |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 16 |
word count | 32 words |
character code | 32 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 32X8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum slew rate | 0.085 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
S82S23F/883B | N82S123AF | N82S123F-B | S82S123W/883B | N82S23NA | N82S123AN-B | N82US123D | N82S23FA | S82S23AF/883C | |
---|---|---|---|---|---|---|---|---|---|
Description | OTP ROM, 32X8, 65ns, TTL, CDIP16 | OTP ROM, 32X8, 25ns, TTL, CDIP16 | OTP ROM, 32X8, 50ns, TTL, CDIP16 | OTP ROM, 32X8, 65ns, TTL, CDFP16 | OTP ROM, 32X8, 50ns, TTL, PDIP16 | OTP ROM, 32X8, 25ns, TTL, PDIP16, | OTP ROM, 32X8, 10ns, TTL, PDSO16 | OTP ROM, 32X8, 50ns, TTL, CDIP16 | OTP ROM, 32X8, 35ns, TTL, CDIP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 65 ns | 25 ns | 50 ns | 65 ns | - | 25 ns | 10 ns | 50 ns | 35 ns |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | - | R-PDIP-T16 | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | - | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
Number of terminals | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
word count | 32 words | 32 words | 32 words | 32 words | - | 32 words | 32 words | 32 words | 32 words |
character code | 32 | 32 | 32 | 32 | - | 32 | 32 | 32 | 32 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | - | 70 °C | 70 °C | 70 °C | 125 °C |
organize | 32X8 | 32X8 | 32X8 | 32X8 | - | 32X8 | 32X8 | 32X8 | 32X8 |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DFP | - | DIP | SOP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | - | DIP16,.3 | SOP16,.4 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | FLATPACK | - | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 0.085 mA | 0.096 mA | 0.096 mA | 0.085 mA | - | 0.096 mA | 0.115 mA | 0.077 mA | 0.11 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | - | NO | YES | NO | NO |
technology | TTL | TTL | TTL | TTL | - | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
Maker | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |