S82S23AF/883C datasheet, PDF - EEWORLD Datasheet

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S82S23AF/883C: DescriptionOTP ROM, 32X8, 35ns, TTL, CDIP16; Categorystorage storage; File Size131KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S82S23AF/883C Overview

OTP ROM, 32X8, 35ns, TTL, CDIP16

S82S23AF/883C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	35 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	OTP ROM
memory width	8
Number of terminals	16
word count	32 words
character code	32
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32X8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class C
Maximum slew rate	0.11 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

S82S23AF/883C Related Products

	S82S23AF/883C	S82S23F/883B	N82S123AF	N82S123F-B	S82S123W/883B	N82S23NA	N82S123AN-B	N82US123D	N82S23FA
Description	OTP ROM, 32X8, 35ns, TTL, CDIP16	OTP ROM, 32X8, 65ns, TTL, CDIP16	OTP ROM, 32X8, 25ns, TTL, CDIP16	OTP ROM, 32X8, 50ns, TTL, CDIP16	OTP ROM, 32X8, 65ns, TTL, CDFP16	OTP ROM, 32X8, 50ns, TTL, PDIP16	OTP ROM, 32X8, 25ns, TTL, PDIP16,	OTP ROM, 32X8, 10ns, TTL, PDSO16	OTP ROM, 32X8, 50ns, TTL, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.4	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Maximum access time	35 ns	65 ns	25 ns	50 ns	65 ns	-	25 ns	10 ns	50 ns
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	-	R-PDIP-T16	R-PDSO-G16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	-	e0	e0	e0
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	-	8	8	8
Number of terminals	16	16	16	16	16	-	16	16	16
word count	32 words	32 words	32 words	32 words	32 words	-	32 words	32 words	32 words
character code	32	32	32	32	32	-	32	32	32
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	125 °C	-	70 °C	70 °C	70 °C
organize	32X8	32X8	32X8	32X8	32X8	-	32X8	32X8	32X8
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	-	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DFP	-	DIP	SOP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	-	DIP16,.3	SOP16,.4	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	-	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	-	Not Qualified	Not Qualified
Maximum slew rate	0.11 mA	0.085 mA	0.096 mA	0.096 mA	0.085 mA	-	0.096 mA	0.115 mA	0.077 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	-	NO	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	-	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL

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