N82S23NA datasheet, PDF - EEWORLD Datasheet

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N82S23NA: DescriptionOTP ROM, 32X8, 50ns, TTL, PDIP16; Categorystorage storage; File Size131KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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N82S23NA Overview

OTP ROM, 32X8, 50ns, TTL, PDIP16

N82S23NA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown

N82S23NA Related Products

	N82S23NA	S82S23F/883B	N82S123AF	N82S123F-B	S82S123W/883B	N82S123AN-B	N82US123D	N82S23FA	S82S23AF/883C
Description	OTP ROM, 32X8, 50ns, TTL, PDIP16	OTP ROM, 32X8, 65ns, TTL, CDIP16	OTP ROM, 32X8, 25ns, TTL, CDIP16	OTP ROM, 32X8, 50ns, TTL, CDIP16	OTP ROM, 32X8, 65ns, TTL, CDFP16	OTP ROM, 32X8, 25ns, TTL, PDIP16,	OTP ROM, 32X8, 10ns, TTL, PDSO16	OTP ROM, 32X8, 50ns, TTL, CDIP16	OTP ROM, 32X8, 35ns, TTL, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	DIP, DIP16,.3	SOP, SOP16,.4	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Maximum access time	-	65 ns	25 ns	50 ns	65 ns	25 ns	10 ns	50 ns	35 ns
JESD-30 code	-	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	R-PDIP-T16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	-	e0	e0	e0	e0	e0	e0	e0	e0
Memory IC Type	-	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	-	8	8	8	8	8	8	8	8
Number of terminals	-	16	16	16	16	16	16	16	16
word count	-	32 words	32 words	32 words	32 words	32 words	32 words	32 words	32 words
character code	-	32	32	32	32	32	32	32	32
Maximum operating temperature	-	125 °C	70 °C	70 °C	125 °C	70 °C	70 °C	70 °C	125 °C
organize	-	32X8	32X8	32X8	32X8	32X8	32X8	32X8	32X8
Package body material	-	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	-	DIP	DIP	DIP	DFP	DIP	SOP	DIP	DIP
Encapsulate equivalent code	-	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	DIP16,.3	SOP16,.4	DIP16,.3	DIP16,.3
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	-	0.085 mA	0.096 mA	0.096 mA	0.085 mA	0.096 mA	0.115 mA	0.077 mA	0.11 mA
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	-	NO	NO	NO	YES	NO	YES	NO	NO
technology	-	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	-	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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