S82S123W/883B datasheet, PDF - EEWORLD Datasheet

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S82S123W/883B: DescriptionOTP ROM, 32X8, 65ns, TTL, CDFP16; Categorystorage storage; File Size131KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S82S123W/883B Overview

OTP ROM, 32X8, 65ns, TTL, CDFP16

S82S123W/883B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
Maximum access time	65 ns
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Memory IC Type	OTP ROM
memory width	8
Number of terminals	16
word count	32 words
character code	32
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32X8
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum slew rate	0.085 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

S82S123W/883B Related Products

	S82S123W/883B	S82S23F/883B	N82S123AF	N82S123F-B	N82S23NA	N82S123AN-B	N82US123D	N82S23FA	S82S23AF/883C
Description	OTP ROM, 32X8, 65ns, TTL, CDFP16	OTP ROM, 32X8, 65ns, TTL, CDIP16	OTP ROM, 32X8, 25ns, TTL, CDIP16	OTP ROM, 32X8, 50ns, TTL, CDIP16	OTP ROM, 32X8, 50ns, TTL, PDIP16	OTP ROM, 32X8, 25ns, TTL, PDIP16,	OTP ROM, 32X8, 10ns, TTL, PDSO16	OTP ROM, 32X8, 50ns, TTL, CDIP16	OTP ROM, 32X8, 35ns, TTL, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.4	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Maximum access time	65 ns	65 ns	25 ns	50 ns	-	25 ns	10 ns	50 ns	35 ns
JESD-30 code	R-XDFP-F16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	-	R-PDIP-T16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	-	e0	e0	e0	e0
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	-	8	8	8	8
Number of terminals	16	16	16	16	-	16	16	16	16
word count	32 words	32 words	32 words	32 words	-	32 words	32 words	32 words	32 words
character code	32	32	32	32	-	32	32	32	32
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	-	70 °C	70 °C	70 °C	125 °C
organize	32X8	32X8	32X8	32X8	-	32X8	32X8	32X8	32X8
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	-	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DIP	DIP	-	DIP	SOP	DIP	DIP
Encapsulate equivalent code	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	-	DIP16,.3	SOP16,.4	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	IN-LINE	IN-LINE	-	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-	-	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.085 mA	0.085 mA	0.096 mA	0.096 mA	-	0.096 mA	0.115 mA	0.077 mA	0.11 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	-	NO	YES	NO	NO
technology	TTL	TTL	TTL	TTL	-	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL

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