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MAX3393EEBC

Description
Interface Circuit, BICMOS, PBGA12
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size486KB,31 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX3393EEBC Overview

Interface Circuit, BICMOS, PBGA12

MAX3393EEBC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Reach Compliance Codenot_compliant
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeR-PBGA-B12
JESD-609 codee0
Humidity sensitivity level1
Number of terminals12
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA12,3X4,20
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
power supply1.8/5 V
Certification statusNot Qualified
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Base Number Matches1

MAX3393EEBC Related Products

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Description Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA8 Interface Circuit, Interface Circuit, BICMOS, PBGA8 Interface Circuit, Interface Circuit, BICMOS, PDSO8 Interface Circuit, BICMOS, PDSO14,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Lead free Contains lead Lead free Contains lead Lead free
Is it Rohs certified? incompatible incompatible incompatible incompatible conform to incompatible conform to incompatible conform to
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant compliant not_compliant compliant not_compliant compliant
JESD-30 code R-PBGA-B12 R-PBGA-B12 R-PBGA-B12 S-PBGA-B8 R-PDSO-G8 S-PBGA-B8 R-PDSO-G8 R-PDSO-G8 R-PDSO-N14
Number of terminals 12 12 12 8 8 8 8 8 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA LSSOP FBGA LSSOP TSSOP SON
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
surface mount YES YES YES YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL GULL WING BALL GULL WING GULL WING NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm 0.65 mm 0.635 mm 0.4 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM DUAL BOTTOM DUAL DUAL DUAL
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT -
JESD-609 code e0 e0 e0 - e4 e0 e4 e0 -
Humidity sensitivity level 1 1 1 - 1 1 1 1 -
Encapsulate equivalent code BGA12,3X4,20 BGA12,3X4,20 BGA12,3X4,20 BGA8,3X3,20 - BGA8,3X3,20 - TSSOP8,.1 SOLCC14,.12,16
power supply 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V - 1.8/5 V - 1.8/5 V 1.8/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified Not Qualified
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) - Gold (Au) - with Nickel (Ni) barrier Tin/Lead (Sn63Pb37) Gold (Au) - with Nickel (Ni) barrier Tin/Lead (Sn85Pb15) -
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