Interface Circuit,
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| package instruction | LSSOP, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| Interface integrated circuit type | INTERFACE CIRCUIT |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 2.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum seat height | 1.45 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 1.2 V |
| Nominal supply voltage | 1.8 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Gold (Au) - with Nickel (Ni) barrier |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.625 mm |
| MAX3374EEKA+ | MAX3377EEBC | MAX3379EEBC | MAX3393EEBC | MAX3373EEBL | MAX3373EEKA+ | MAX3374EEBL | MAX3375EEKA | MAX3378EETD+ | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Interface Circuit, | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA8 | Interface Circuit, | Interface Circuit, BICMOS, PBGA8 | Interface Circuit, BICMOS, PDSO8 | Interface Circuit, BICMOS, PDSO14, |
| Is it lead-free? | Lead free | Contains lead | Contains lead | Contains lead | Contains lead | Lead free | Contains lead | Contains lead | Lead free |
| Is it Rohs certified? | conform to | incompatible | incompatible | incompatible | incompatible | conform to | incompatible | incompatible | conform to |
| Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | compliant |
| JESD-30 code | R-PDSO-G8 | R-PBGA-B12 | R-PBGA-B12 | R-PBGA-B12 | S-PBGA-B8 | R-PDSO-G8 | S-PBGA-B8 | R-PDSO-G8 | R-PDSO-N14 |
| Number of terminals | 8 | 12 | 12 | 12 | 8 | 8 | 8 | 8 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LSSOP | FBGA | FBGA | FBGA | FBGA | LSSOP | FBGA | TSSOP | SON |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | BALL | BALL | BALL | BALL | GULL WING | BALL | GULL WING | NO LEAD |
| Terminal pitch | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.635 mm | 0.4 mm |
| Terminal location | DUAL | BOTTOM | BOTTOM | BOTTOM | BOTTOM | DUAL | BOTTOM | DUAL | DUAL |
| Maker | Maxim | Maxim | Maxim | - | Maxim | Maxim | Maxim | Maxim | Maxim |
| Interface integrated circuit type | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - |
| JESD-609 code | e4 | e0 | e0 | e0 | - | e4 | e0 | e0 | - |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| Terminal surface | Gold (Au) - with Nickel (Ni) barrier | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | - | Gold (Au) - with Nickel (Ni) barrier | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | - |
| Encapsulate equivalent code | - | BGA12,3X4,20 | BGA12,3X4,20 | BGA12,3X4,20 | BGA8,3X3,20 | - | BGA8,3X3,20 | TSSOP8,.1 | SOLCC14,.12,16 |
| power supply | - | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | - | 1.8/5 V | 1.8/5 V | 1.8/5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
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