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MAX3375EEKA

Description
Interface Circuit, BICMOS, PDSO8
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size486KB,31 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX3375EEKA Overview

Interface Circuit, BICMOS, PDSO8

MAX3375EEKA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Reach Compliance Codenot_compliant
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeR-PDSO-G8
JESD-609 codee0
Humidity sensitivity level1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply1.8/5 V
Certification statusNot Qualified
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL

MAX3375EEKA Related Products

MAX3375EEKA MAX3377EEBC MAX3379EEBC MAX3393EEBC MAX3373EEBL MAX3373EEKA+ MAX3374EEBL MAX3374EEKA+ MAX3378EETD+
Description Interface Circuit, BICMOS, PDSO8 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA8 Interface Circuit, Interface Circuit, BICMOS, PBGA8 Interface Circuit, Interface Circuit, BICMOS, PDSO14,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Lead free Contains lead Lead free Lead free
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible conform to incompatible conform to conform to
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant compliant not_compliant compliant compliant
JESD-30 code R-PDSO-G8 R-PBGA-B12 R-PBGA-B12 R-PBGA-B12 S-PBGA-B8 R-PDSO-G8 S-PBGA-B8 R-PDSO-G8 R-PDSO-N14
Number of terminals 8 12 12 12 8 8 8 8 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP FBGA FBGA FBGA FBGA LSSOP FBGA LSSOP SON
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
surface mount YES YES YES YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING BALL BALL BALL BALL GULL WING BALL GULL WING NO LEAD
Terminal pitch 0.635 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.5 mm 0.65 mm 0.4 mm
Terminal location DUAL BOTTOM BOTTOM BOTTOM BOTTOM DUAL BOTTOM DUAL DUAL
Maker Maxim Maxim Maxim - Maxim Maxim Maxim Maxim Maxim
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT -
JESD-609 code e0 e0 e0 e0 - e4 e0 e4 -
Humidity sensitivity level 1 1 1 1 - 1 1 1 -
Encapsulate equivalent code TSSOP8,.1 BGA12,3X4,20 BGA12,3X4,20 BGA12,3X4,20 BGA8,3X3,20 - BGA8,3X3,20 - SOLCC14,.12,16
power supply 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V - 1.8/5 V - 1.8/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) - Gold (Au) - with Nickel (Ni) barrier Tin/Lead (Sn63Pb37) Gold (Au) - with Nickel (Ni) barrier -

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