Interface Circuit, BICMOS, PBGA8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Reach Compliance Code | not_compliant |
Interface integrated circuit type | INTERFACE CIRCUIT |
JESD-30 code | S-PBGA-B8 |
JESD-609 code | e0 |
Humidity sensitivity level | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA8,3X3,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
power supply | 1.8/5 V |
Certification status | Not Qualified |
surface mount | YES |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
MAX3374EEBL | MAX3377EEBC | MAX3379EEBC | MAX3393EEBC | MAX3373EEBL | MAX3373EEKA+ | MAX3374EEKA+ | MAX3375EEKA | MAX3378EETD+ | |
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Description | Interface Circuit, BICMOS, PBGA8 | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA12 | Interface Circuit, BICMOS, PBGA8 | Interface Circuit, | Interface Circuit, | Interface Circuit, BICMOS, PDSO8 | Interface Circuit, BICMOS, PDSO14, |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Lead free | Lead free | Contains lead | Lead free |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | conform to | conform to | incompatible | conform to |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | not_compliant | compliant |
JESD-30 code | S-PBGA-B8 | R-PBGA-B12 | R-PBGA-B12 | R-PBGA-B12 | S-PBGA-B8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N14 |
Number of terminals | 8 | 12 | 12 | 12 | 8 | 8 | 8 | 8 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | FBGA | FBGA | FBGA | LSSOP | LSSOP | TSSOP | SON |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL | BALL | BALL | GULL WING | GULL WING | GULL WING | NO LEAD |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.635 mm | 0.4 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL |
Maker | Maxim | Maxim | Maxim | - | Maxim | Maxim | Maxim | Maxim | Maxim |
Interface integrated circuit type | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - |
JESD-609 code | e0 | e0 | e0 | e0 | - | e4 | e4 | e0 | - |
Humidity sensitivity level | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
Encapsulate equivalent code | BGA8,3X3,20 | BGA12,3X4,20 | BGA12,3X4,20 | BGA12,3X4,20 | BGA8,3X3,20 | - | - | TSSOP8,.1 | SOLCC14,.12,16 |
power supply | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | - | - | 1.8/5 V | 1.8/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | - | Gold (Au) - with Nickel (Ni) barrier | Gold (Au) - with Nickel (Ni) barrier | Tin/Lead (Sn85Pb15) | - |