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MAX3374EEBL

Description
Interface Circuit, BICMOS, PBGA8
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size486KB,31 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX3374EEBL Overview

Interface Circuit, BICMOS, PBGA8

MAX3374EEBL Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Reach Compliance Codenot_compliant
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PBGA-B8
JESD-609 codee0
Humidity sensitivity level1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA8,3X3,20
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
power supply1.8/5 V
Certification statusNot Qualified
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM

MAX3374EEBL Related Products

MAX3374EEBL MAX3377EEBC MAX3379EEBC MAX3393EEBC MAX3373EEBL MAX3373EEKA+ MAX3374EEKA+ MAX3375EEKA MAX3378EETD+
Description Interface Circuit, BICMOS, PBGA8 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA12 Interface Circuit, BICMOS, PBGA8 Interface Circuit, Interface Circuit, Interface Circuit, BICMOS, PDSO8 Interface Circuit, BICMOS, PDSO14,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Lead free Lead free Contains lead Lead free
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible conform to conform to incompatible conform to
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant compliant compliant not_compliant compliant
JESD-30 code S-PBGA-B8 R-PBGA-B12 R-PBGA-B12 R-PBGA-B12 S-PBGA-B8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-N14
Number of terminals 8 12 12 12 8 8 8 8 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA FBGA LSSOP LSSOP TSSOP SON
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
surface mount YES YES YES YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm 0.65 mm 0.635 mm 0.4 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM DUAL DUAL DUAL DUAL
Maker Maxim Maxim Maxim - Maxim Maxim Maxim Maxim Maxim
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT -
JESD-609 code e0 e0 e0 e0 - e4 e4 e0 -
Humidity sensitivity level 1 1 1 1 - 1 1 1 -
Encapsulate equivalent code BGA8,3X3,20 BGA12,3X4,20 BGA12,3X4,20 BGA12,3X4,20 BGA8,3X3,20 - - TSSOP8,.1 SOLCC14,.12,16
power supply 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V - - 1.8/5 V 1.8/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified Not Qualified
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) - Gold (Au) - with Nickel (Ni) barrier Gold (Au) - with Nickel (Ni) barrier Tin/Lead (Sn85Pb15) -
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