MAX3373EEBL datasheet, PDF - EEWORLD Datasheet

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MAX3373EEBL: DescriptionInterface Circuit, BICMOS, PBGA8; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size486KB，31 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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MAX3373EEBL Overview

Interface Circuit, BICMOS, PBGA8

MAX3373EEBL Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Maxim
Reach Compliance Code	not_compliant
Factory Lead Time	1 week
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-PBGA-B8
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA8,3X3,20
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	1.8/5 V
Certification status	Not Qualified
surface mount	YES
technology	BICMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM

MAX3373EEBL Related Products

	MAX3373EEBL	MAX3377EEBC	MAX3379EEBC	MAX3393EEBC	MAX3373EEKA+	MAX3374EEBL	MAX3374EEKA+	MAX3375EEKA	MAX3378EETD+
Description	Interface Circuit, BICMOS, PBGA8	Interface Circuit, BICMOS, PBGA12	Interface Circuit, BICMOS, PBGA12	Interface Circuit, BICMOS, PBGA12	Interface Circuit,	Interface Circuit, BICMOS, PBGA8	Interface Circuit,	Interface Circuit, BICMOS, PDSO8	Interface Circuit, BICMOS, PDSO14,
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Lead free	Contains lead	Lead free	Contains lead	Lead free
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	conform to	incompatible	conform to	incompatible	conform to
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	compliant	not_compliant	compliant	not_compliant	compliant
JESD-30 code	S-PBGA-B8	R-PBGA-B12	R-PBGA-B12	R-PBGA-B12	R-PDSO-G8	S-PBGA-B8	R-PDSO-G8	R-PDSO-G8	R-PDSO-N14
Number of terminals	8	12	12	12	8	8	8	8	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA	LSSOP	FBGA	LSSOP	TSSOP	SON
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	GRID ARRAY, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	GULL WING	BALL	GULL WING	GULL WING	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.635 mm	0.4 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	DUAL
Maker	Maxim	Maxim	Maxim	-	Maxim	Maxim	Maxim	Maxim	Maxim
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	-
Encapsulate equivalent code	BGA8,3X3,20	BGA12,3X4,20	BGA12,3X4,20	BGA12,3X4,20	-	BGA8,3X3,20	-	TSSOP8,.1	SOLCC14,.12,16
power supply	1.8/5 V	1.8/5 V	1.8/5 V	1.8/5 V	-	1.8/5 V	-	1.8/5 V	1.8/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
JESD-609 code	-	e0	e0	e0	e4	e0	e4	e0	-
Humidity sensitivity level	-	1	1	1	1	1	1	1	-
Terminal surface	-	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Gold (Au) - with Nickel (Ni) barrier	Tin/Lead (Sn63Pb37)	Gold (Au) - with Nickel (Ni) barrier	Tin/Lead (Sn85Pb15)	-

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