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MT9075BPR1

Description
DATACOM, FRAMER, PQCC68
CategoryWireless rf/communication    Telecom circuit   
File Size839KB,102 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
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MT9075BPR1 Overview

DATACOM, FRAMER, PQCC68

MT9075BPR1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionQCCJ,
Reach Compliance Codecompli
JESD-30 codeS-PQCC-J68
JESD-609 codee3
length24.23 mm
Humidity sensitivity level3
Number of functions1
Number of terminals68
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height4.57 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width24.23 mm

MT9075BPR1 Related Products

MT9075BPR1 MT9075BL MT9075BPR MT9075B MT9075BP MT9075BP1 MT9075BL1
Description DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQCC68 DATACOM, FRAMER, PQFP100
length 24.23 mm 20 mm 24.23 mm 24.23 mm 24.23 mm 24.23 mm 20 mm
Number of functions 1 1 1 1 1 1 1
Number of terminals 68 100 68 68 68 68 100
Maximum operating temperature 85 °C 85 °C 85 °C 85 Cel 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 Cel -40 °C -40 °C -40 °C
surface mount YES YES YES YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND GULL WING J BEND J BEND J BEND J BEND GULL WING
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 24.23 mm 14 mm 24.23 mm 24.23 mm 24.23 mm 24.23 mm 14 mm
Is it Rohs certified? conform to incompatible incompatible - incompatible conform to conform to
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction QCCJ, 14 X 20 MM, 2.80 MM HEIGHT, MO-112CC-1, MQFP-100 QCCJ, LDCC68,1.0SQ - QCCJ, LDCC68,1.0SQ QCCJ, QFP,
Reach Compliance Code compli unknow compli - compli compli compli
JESD-30 code S-PQCC-J68 R-PQFP-G100 S-PQCC-J68 - S-PQCC-J68 S-PQCC-J68 R-PQFP-G100
JESD-609 code e3 e0 e0 - e0 e3 e3
Humidity sensitivity level 3 3 1 - 1 3 3
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QFP QCCJ - QCCJ QCCJ QFP
Package shape SQUARE RECTANGULAR SQUARE - SQUARE SQUARE RECTANGULAR
Package form CHIP CARRIER FLATPACK CHIP CARRIER - CHIP CARRIER CHIP CARRIER FLATPACK
Peak Reflow Temperature (Celsius) 260 225 225 - 225 260 260
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 3.4 mm 4.57 mm - 4.57 mm 4.57 mm 3.4 mm
Nominal supply voltage 5 V 5 V 5 V - 5 V 5 V 5 V
Telecom integrated circuit types FRAMER FRAMER FRAMER - FRAMER FRAMER FRAMER
Terminal surface Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn)
Terminal pitch 1.27 mm 0.65 mm 1.27 mm - 1.27 mm 1.27 mm 0.65 mm
Maximum time at peak reflow temperature 30 30 30 - 30 30 30
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