DATACOM, FRAMER, PQCC68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Zarlink Semiconductor (Microsemi) |
| package instruction | 14 X 20 MM, 2.80 MM HEIGHT, MO-112CC-1, MQFP-100 |
| Reach Compliance Code | unknow |
| Carrier type | CEPT PCM-30/E-1 |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 20 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 100 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.7X1.0 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.4 mm |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | FRAMER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 14 mm |
| MT9075BL | MT9075BPR | MT9075B | MT9075BP | MT9075BPR1 | MT9075BP1 | MT9075BL1 | |
|---|---|---|---|---|---|---|---|
| Description | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQCC68 | DATACOM, FRAMER, PQFP100 |
| length | 20 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 20 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 100 | 68 | 68 | 68 | 68 | 68 | 100 |
| Maximum operating temperature | 85 °C | 85 °C | 85 Cel | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 Cel | -40 °C | -40 °C | -40 °C | -40 °C |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | J BEND | J BEND | J BEND | J BEND | J BEND | GULL WING |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| width | 14 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 24.23 mm | 14 mm |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | conform to | conform to | conform to |
| Maker | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| package instruction | 14 X 20 MM, 2.80 MM HEIGHT, MO-112CC-1, MQFP-100 | QCCJ, LDCC68,1.0SQ | - | QCCJ, LDCC68,1.0SQ | QCCJ, | QCCJ, | QFP, |
| Reach Compliance Code | unknow | compli | - | compli | compli | compli | compli |
| JESD-30 code | R-PQFP-G100 | S-PQCC-J68 | - | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 | - | e0 | e3 | e3 | e3 |
| Humidity sensitivity level | 3 | 1 | - | 1 | 3 | 3 | 3 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QCCJ | - | QCCJ | QCCJ | QCCJ | QFP |
| Package shape | RECTANGULAR | SQUARE | - | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| Peak Reflow Temperature (Celsius) | 225 | 225 | - | 225 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.4 mm | 4.57 mm | - | 4.57 mm | 4.57 mm | 4.57 mm | 3.4 mm |
| Nominal supply voltage | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| Telecom integrated circuit types | FRAMER | FRAMER | - | FRAMER | FRAMER | FRAMER | FRAMER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal pitch | 0.65 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| Maximum time at peak reflow temperature | 30 | 30 | - | 30 | 30 | 30 | 30 |
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