MT9075BPR datasheet, PDF - EEWORLD Datasheet

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MT9075BPR: DescriptionDATACOM, FRAMER, PQCC68; CategoryWireless rf/communication Telecom circuit; File Size839KB，102 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/

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MT9075BPR Overview

DATACOM, FRAMER, PQCC68

MT9075BPR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Zarlink Semiconductor (Microsemi)
package instruction	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	compli
Carrier type	CEPT PCM-30/E-1
JESD-30 code	S-PQCC-J68
JESD-609 code	e0
length	24.23 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	68
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	0.15 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	24.23 mm

MT9075BPR Related Products

	MT9075BPR	MT9075BL	MT9075B	MT9075BP	MT9075BPR1	MT9075BP1	MT9075BL1
Description	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQFP100
length	24.23 mm	20 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm	20 mm
Number of functions	1	1	1	1	1	1	1
Number of terminals	68	100	68	68	68	68	100
Maximum operating temperature	85 °C	85 °C	85 Cel	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C
surface mount	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	J BEND	GULL WING	J BEND	J BEND	J BEND	J BEND	GULL WING
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	24.23 mm	14 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm	14 mm
Is it Rohs certified?	incompatible	incompatible	-	incompatible	conform to	conform to	conform to
Maker	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	-	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)
package instruction	QCCJ, LDCC68,1.0SQ	14 X 20 MM, 2.80 MM HEIGHT, MO-112CC-1, MQFP-100	-	QCCJ, LDCC68,1.0SQ	QCCJ,	QCCJ,	QFP,
Reach Compliance Code	compli	unknow	-	compli	compli	compli	compli
JESD-30 code	S-PQCC-J68	R-PQFP-G100	-	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	R-PQFP-G100
JESD-609 code	e0	e0	-	e0	e3	e3	e3
Humidity sensitivity level	1	3	-	1	3	3	3
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QFP	-	QCCJ	QCCJ	QCCJ	QFP
Package shape	SQUARE	RECTANGULAR	-	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	-	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	FLATPACK
Peak Reflow Temperature (Celsius)	225	225	-	225	260	260	260
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	3.4 mm	-	4.57 mm	4.57 mm	4.57 mm	3.4 mm
Nominal supply voltage	5 V	5 V	-	5 V	5 V	5 V	5 V
Telecom integrated circuit types	FRAMER	FRAMER	-	FRAMER	FRAMER	FRAMER	FRAMER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal pitch	1.27 mm	0.65 mm	-	1.27 mm	1.27 mm	1.27 mm	0.65 mm
Maximum time at peak reflow temperature	30	30	-	30	30	30	30

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