MT9075BL1 datasheet, PDF - EEWORLD Datasheet

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MT9075BL1: DescriptionDATACOM, FRAMER, PQFP100; CategoryWireless rf/communication Telecom circuit; File Size839KB，102 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/; Environmental Compliance

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MT9075BL1 Overview

DATACOM, FRAMER, PQFP100

MT9075BL1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Zarlink Semiconductor (Microsemi)
package instruction	QFP,
Reach Compliance Code	compli
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	3.4 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

MT9075BL1 Related Products

	MT9075BL1	MT9075BL	MT9075BPR	MT9075B	MT9075BP	MT9075BPR1	MT9075BP1
Description	DATACOM, FRAMER, PQFP100	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68	DATACOM, FRAMER, PQCC68
length	20 mm	20 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm
Number of functions	1	1	1	1	1	1	1
Number of terminals	100	100	68	68	68	68	68
Maximum operating temperature	85 °C	85 °C	85 °C	85 Cel	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 Cel	-40 °C	-40 °C	-40 °C
surface mount	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	14 mm	14 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm	24.23 mm
Is it Rohs certified?	conform to	incompatible	incompatible	-	incompatible	conform to	conform to
Maker	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	-	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)
package instruction	QFP,	14 X 20 MM, 2.80 MM HEIGHT, MO-112CC-1, MQFP-100	QCCJ, LDCC68,1.0SQ	-	QCCJ, LDCC68,1.0SQ	QCCJ,	QCCJ,
Reach Compliance Code	compli	unknow	compli	-	compli	compli	compli
JESD-30 code	R-PQFP-G100	R-PQFP-G100	S-PQCC-J68	-	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e3	e0	e0	-	e0	e3	e3
Humidity sensitivity level	3	3	1	-	1	3	3
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QCCJ	-	QCCJ	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	CHIP CARRIER	-	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260	225	225	-	225	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.4 mm	3.4 mm	4.57 mm	-	4.57 mm	4.57 mm	4.57 mm
Nominal supply voltage	5 V	5 V	5 V	-	5 V	5 V	5 V
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER	-	FRAMER	FRAMER	FRAMER
Terminal surface	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal pitch	0.65 mm	0.65 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	30	30	30	-	30	30	30

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