CY7C433-30DI datasheet, PDF - EEWORLD Datasheet

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CY7C433-30DI: DescriptionFIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28; Categorystorage storage; File Size339KB，13 Pages; ManufacturerCypress Semiconductor

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CY7C433-30DI Overview

FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28

CY7C433-30DI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	0.300 INCH, CERDIP-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	30 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	25 MHz
period time	40 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.0205 mm
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.025 A
Maximum slew rate	0.155 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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Description	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	DIP	QFJ	DIP	DIP	QFJ	QFJ	DIP	DIP	QFJ	DIP
package instruction	0.300 INCH, CERDIP-28	CERAMIC, LCC-32	0.300 INCH, CERDIP-28	0.600 INCH, CERDIP-28	CERAMIC, LCC-32	CERAMIC, LCC-32	0.600 INCH, CERDIP-28	0.300 INCH, CERDIP-28	CERAMIC, LCC-32	0.600 INCH, CERDIP-28
Contacts	28	32	28	28	32	32	28	28	32	28
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	65 ns	65 ns	30 ns	40 ns	30 ns	40 ns	40 ns	25 ns	65 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	25 MHz	12.5 MHz	12.5 MHz	25 MHz	20 MHz	25 MHz	20 MHz	20 MHz	28.5 MHz	12.5 MHz
period time	40 ns	80 ns	80 ns	40 ns	50 ns	40 ns	50 ns	50 ns	35 ns	80 ns
JESD-30 code	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	37.0205 mm	13.97 mm	37.0205 mm	37.338 mm	13.97 mm	13.97 mm	37.338 mm	37.0205 mm	13.97 mm	37.338 mm
memory density	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	32	28	28	32	32	28	28	32	28
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-	-40 °C	-40 °C	-	-40 °C
organize	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	DIP	DIP	QCCN	QCCN	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	DIP28,.3	LCC32,.45X.55	DIP28,.3	DIP28,.6	LCC32,.45X.55	LCC32,.45X.55	DIP28,.6	DIP28,.3	LCC32,.45X.55	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.286 mm	5.08 mm	5.715 mm	2.286 mm	2.286 mm	5.715 mm	5.08 mm	2.286 mm	5.715 mm
Maximum standby current	0.025 A	0.02 A	0.025 A	0.025 A	0.02 A	0.02 A	0.025 A	0.025 A	0.02 A	0.025 A
Maximum slew rate	0.155 mA	0.11 mA	0.13 mA	0.155 mA	0.125 mA	0.135 mA	0.145 mA	0.145 mA	0.142 mA	0.13 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	11.43 mm	7.62 mm	15.24 mm	11.43 mm	11.43 mm	15.24 mm	7.62 mm	11.43 mm	15.24 mm

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