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Datasheet> All Categories > storage> storage> CY7C433-40DI
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CY7C433-40DI

Description
FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28
Categorystorage    storage   
File Size339KB，13 Pages
ManufacturerCypress Semiconductor
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CY7C433-40DI Overview

FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28

CY7C433-40DI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instruction0.300 INCH, CERDIP-28
Contacts28
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time40 ns
Other featuresRETRANSMIT
Maximum clock frequency (fCLK)20 MHz
period time50 ns
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.0205 mm
memory density36864 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals28
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4KX9
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.025 A
Maximum slew rate0.145 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

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CY7C433-40DI Related Products

CY7C433-40DI CY7C433-65LC CY7C433-65DI CY7C433-30DI CY7C432-30DI CY7C433-40LC CY7C433-30LC CY7C432-40DI CY7C433-25LC CY7C432-65DI
Description FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 4KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 FIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 FIFO, 4KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code DIP QFJ DIP DIP DIP QFJ QFJ DIP QFJ DIP
package instruction 0.300 INCH, CERDIP-28 CERAMIC, LCC-32 0.300 INCH, CERDIP-28 0.300 INCH, CERDIP-28 0.600 INCH, CERDIP-28 CERAMIC, LCC-32 CERAMIC, LCC-32 0.600 INCH, CERDIP-28 CERAMIC, LCC-32 0.600 INCH, CERDIP-28
Contacts 28 32 28 28 28 32 32 28 32 28
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 40 ns 65 ns 65 ns 30 ns 30 ns 40 ns 30 ns 40 ns 25 ns 65 ns
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
Maximum clock frequency (fCLK) 20 MHz 12.5 MHz 12.5 MHz 25 MHz 25 MHz 20 MHz 25 MHz 20 MHz 28.5 MHz 12.5 MHz
period time 50 ns 80 ns 80 ns 40 ns 40 ns 50 ns 40 ns 50 ns 35 ns 80 ns
JESD-30 code R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-CQCC-N32 R-CQCC-N32 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 37.0205 mm 13.97 mm 37.0205 mm 37.0205 mm 37.338 mm 13.97 mm 13.97 mm 37.338 mm 13.97 mm 37.338 mm
memory density 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 32 28 28 28 32 32 28 32 28
word count 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words
character code 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C - - -40 °C - -40 °C
organize 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable NO NO NO NO NO NO NO NO NO NO
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code DIP QCCN DIP DIP DIP QCCN QCCN DIP QCCN DIP
Encapsulate equivalent code DIP28,.3 LCC32,.45X.55 DIP28,.3 DIP28,.3 DIP28,.6 LCC32,.45X.55 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 2.286 mm 5.08 mm 5.08 mm 5.715 mm 2.286 mm 2.286 mm 5.715 mm 2.286 mm 5.715 mm
Maximum standby current 0.025 A 0.02 A 0.025 A 0.025 A 0.025 A 0.02 A 0.02 A 0.025 A 0.02 A 0.025 A
Maximum slew rate 0.145 mA 0.11 mA 0.13 mA 0.155 mA 0.155 mA 0.125 mA 0.135 mA 0.145 mA 0.142 mA 0.13 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO NO YES YES NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL DUAL QUAD QUAD DUAL QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 11.43 mm 7.62 mm 7.62 mm 15.24 mm 11.43 mm 11.43 mm 15.24 mm 11.43 mm 15.24 mm

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