CY7C433-40LC datasheet, PDF - EEWORLD Datasheet

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CY7C433-40LC: DescriptionFIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32; Categorystorage storage; File Size339KB，13 Pages; ManufacturerCypress Semiconductor

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CY7C433-40LC Overview

FIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32

CY7C433-40LC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	QFJ
package instruction	CERAMIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	40 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	20 MHz
period time	50 ns
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.286 mm
Maximum standby current	0.02 A
Maximum slew rate	0.125 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

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	CY7C433-40LC	CY7C433-65LC	CY7C433-65DI	CY7C433-30DI	CY7C432-30DI	CY7C433-30LC	CY7C432-40DI	CY7C433-40DI	CY7C433-25LC	CY7C432-65DI
Description	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28	FIFO, 4KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 4KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	QFJ	QFJ	DIP	DIP	DIP	QFJ	DIP	DIP	QFJ	DIP
package instruction	CERAMIC, LCC-32	CERAMIC, LCC-32	0.300 INCH, CERDIP-28	0.300 INCH, CERDIP-28	0.600 INCH, CERDIP-28	CERAMIC, LCC-32	0.600 INCH, CERDIP-28	0.300 INCH, CERDIP-28	CERAMIC, LCC-32	0.600 INCH, CERDIP-28
Contacts	32	32	28	28	28	32	28	28	32	28
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	40 ns	65 ns	65 ns	30 ns	30 ns	30 ns	40 ns	40 ns	25 ns	65 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	20 MHz	12.5 MHz	12.5 MHz	25 MHz	25 MHz	25 MHz	20 MHz	20 MHz	28.5 MHz	12.5 MHz
period time	50 ns	80 ns	80 ns	40 ns	40 ns	40 ns	50 ns	50 ns	35 ns	80 ns
JESD-30 code	R-CQCC-N32	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	13.97 mm	37.0205 mm	37.0205 mm	37.338 mm	13.97 mm	37.338 mm	37.0205 mm	13.97 mm	37.338 mm
memory density	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	28	28	28	32	28	28	32	28
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C	85 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-	-40 °C
organize	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	QCCN	DIP	DIP	DIP	QCCN	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	DIP28,.3	DIP28,.3	DIP28,.6	LCC32,.45X.55	DIP28,.6	DIP28,.3	LCC32,.45X.55	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.286 mm	2.286 mm	5.08 mm	5.08 mm	5.715 mm	2.286 mm	5.715 mm	5.08 mm	2.286 mm	5.715 mm
Maximum standby current	0.02 A	0.02 A	0.025 A	0.025 A	0.025 A	0.02 A	0.025 A	0.025 A	0.02 A	0.025 A
Maximum slew rate	0.125 mA	0.11 mA	0.13 mA	0.155 mA	0.155 mA	0.135 mA	0.145 mA	0.145 mA	0.142 mA	0.13 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	NO	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.43 mm	11.43 mm	7.62 mm	7.62 mm	15.24 mm	11.43 mm	15.24 mm	7.62 mm	11.43 mm	15.24 mm

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