EEWORLDEEWORLDEEWORLD

Part Number

Search

71V65903S80PFGI

Description
TQFP-100, Tray
Categorystorage    storage   
File Size725KB,24 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
Download Datasheet Parametric View All

71V65903S80PFGI Online Shopping

Suppliers Part Number Price MOQ In stock  
71V65903S80PFGI - - View Buy Now

71V65903S80PFGI Overview

TQFP-100, Tray

71V65903S80PFGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instructionQFP,
Contacts100
Manufacturer packaging codePKG100
Reach Compliance Codecompliant
Samacsys DescriptionTQFP 14.0 X 20.0 X 1.4 MM
Maximum access time8 ns
Other featuresFLOW-THROUGH
JESD-30 codeR-PQFP-G100
JESD-609 codee3
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal locationQUAD
Maximum time at peak reflow temperature30
Base Number Matches1
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
3.3V I/O, Burst Counter
Flow-Through Outputs
Features
IDT71V65703
IDT71V65903
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 100 MHz
(7.5 ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read
cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
4-word burst capability (Interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V (±5%) I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Green parts available, see ordering information
Description
The IDT71V65703/5903 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs organized as 256K x 36 / 512K x 18.
They are designed to eliminate dead bus cycles when turning the bus
around between reads and writes, or writes and reads. Thus they have
been given the name ZBT
TM
, or Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one
clock cycle, and on the next clock cycle the associated data cycle
occurs, be it read or write.
The IDT71V65703/5903 contain address, data-in and control
signal registers. The outputs are flow-through (no output data
register). Output enable is the only asynchronous signal and can be
used to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65703/5903
tobesuspendedaslongasnecessary.Allsynchronousinputsareignoredwhen
CEN
is high and the internal device registers will hold their previous values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three
is not asserted when ADV/LD is low, no new memory operation can
be initiated. However, any pending data transfers (reads or writes)
will be completed. The data bus will tri-state one cycle after the chip
is deselected or a write is initiated.
The IDT71V65703/5903 have an on-chip burst counter. In the burst
mode, the IDT71V65703/5903 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65703/5903 SRAMs utilize a high-performance CMOS
process and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and a 165
fine pitch ball grid array (fBGA).
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance Burst Address/Load New Address
Linear/Interleaved Burst Order
Sleep Mode
Data Input/Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5298 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2014
DSC-5298/05
1
©2014 Integrated Device Technology, Inc.
Please tell me what is the shortcut key to flip a layer in PCB in Altium Designer?
May I ask what are the shortcut keys for flipping a layer in PCB in ALTIUM DESIGNER, including left-right flipping, up-down flipping, and what are the shortcut keys for rotating the layer without flip...
深圳小花 PCB Design
Embedded Qt-Make a stopwatch
[i=s]This post was last edited by DDZZ669 on 2022-8-7 15:55[/i]Previous article: Embedded Qt - Write and run your first ARM-Qt programThis paper introduces how to write the first embedded Qt program a...
DDZZ669 ARM Technology
How complicated is the inside of a sweeping robot? TI E2E will reveal the secrets for you in five steps! Answer the questions and win prizes...
[font=微软雅黑][size=3][color=#ff0000][b]Event details: [/b][/color][/size][/font][url=https://en.eeworld.com/bbs/huodong/TI_E2E_Q2_201906/index.php?sid=107][b][font=微软雅黑][color=#000000]How complicated is...
EEWORLD社区 TI Technology Forum
【Development Kit for nRF52840】+ Three Tools for Evaluation & Cloud Gateway Testing
[i=s]This post was last edited by damiaa on 2018-11-30 12:08[/i] [Development Kit for nRF52840] + Review of the third tool nrf connect 2.6.0 Here is a PC desktop tool for the Development Kit for nRF52...
damiaa MCU
What is carrier bandwidth in wireless communications?
[size=4]1. In wireless communication, the carrier bandwidth is the difference between the highest and lowest frequencies of the carrier, B=Fh-Fl. [/size] [size=4] [/size] [size=4]2. In fact, it is the...
fish001 Wireless Connectivity
[HC32F460 Development Board Review] 09. Implementing read and write operations on W25Q64 through hardware QSPI
The HC32F460 series four-wire serial peripheral interface (QSPI) is a memory control module, which is mainly used to communicate with serial ROM with SPI compatible interface, including serial flash m...
xld0932 Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号