Simple PCB production process

捷多邦PCB技术

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Simple PCB production process: 1. Contact the manufacturer: By registering the customer number online, you can choose to quote, place an order, and follow up the production progress. 2. Cutting: Purpose: According to the requirements of the engineering data MI, cut the large sheet that meets the requirements into small pieces to produce panels. Small pieces of sheet that meet customer requirements. Process: large sheet → cut the board according to MI requirements → braze the board → fillet the corners\grind the edges → board out 3. Drilling: Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the plate that meets the required size. Process: Stacking pins → upper plate → drilling → lower plate → inspection\repair 4. Copper deposition: Purpose: Copper deposition is to deposit a thin layer of copper on the wall of the insulating hole by chemical method. Process: Rough grinding → Hanging board → Copper deposition automatic line → Lower board → Dip % dilute H2SO4 → Thicken copper V. Graphic transfer: Purpose: Graphic transfer is to transfer the image on the production film to the board Process: (Blue oil process): Grinding board → Printing the first side → Drying → Printing the second side → Drying → Exposure → Developing → Inspection; (Dry film process): Hemp board → Laminating → Standing → Alignment → Exposure → Standing → Developing → Inspection 6. Graphic electroplating Purpose: Graphic electroplating is to electroplate a copper layer of required thickness and a gold-nickel or tin layer of required thickness on the exposed copper skin of the circuit pattern or on the hole wall. Process: put on board → degreasing → washing twice → micro-etching → washing → pickling → copper plating → washing → acid dipping → tin plating → washing → lower board VII. Film stripping: Purpose: Use NaOH solution to strip the anti-electroplating covering film layer to expose the non-circuit copper layer. Process: Water film: insert rack → alkali dipping → rinse → scrub → machine; dry film: put board → machine 8. Etching: Purpose: Etching is the use of chemical reaction method to corrode the copper layer of non-circuit parts. 9. Green oil: Purpose: Green oil is used to transfer the pattern of green oil film to the board, which plays a role in protecting the circuit and preventing tin from forming on the circuit when welding parts Process: grinding plate → printing photosensitive green oil → curing plate → exposure → developing; grinding plate → printing the first side → baking plate → printing the second side → baking plate 10. Characters: Purpose: Characters are provided as a mark that is easy to identify Process: After the green oil is finally brazed → Cool and stand → Adjust the screen → Print characters → Post-brazing XI. Gold-plated fingers: Purpose: To plate a nickel\gold layer of the required thickness on the plug fingers to make them more hard and wear-resistant Process: Boarding → Degreasing → Washing twice → Micro-etching → Washing twice → Pickling → Copper plating → Washing → Nickel plating → Washing → Gold plating Tin plate(A parallel process) Purpose: Spray tin is to spray a layer of lead tin on the exposed copper surface not covered with solder mask oil to protect the copper surface from corrosion and oxidation to ensure good welding performance. Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying Twelve. Molding: Purpose: Through mold stamping or CNC gong machine gong out the shape required by the customer. The molding method is organic gong, beer board, hand gong, hand cutting Description: Data gong machine board and beer board have higher precision, hand gong is second, hand cut board can only make some simple shapes at the lowest tool Thirteen, test: Purpose: Through 100% electronic test, detect defects that affect functionality such as open circuit and short circuit that are not easy to find visually. Process: mold → plate placement → test → qualified → FQC visual inspection → unqualified → repair → return to test → OK → REJ → scrap Fourteen, Final Inspection: Purpose: Through 100% visual inspection of the appearance defects of the panels, and repair the minor defects, to avoid the flow of problematic and defective panels. Specific work flow: Incoming materials → Check materials → Visual inspection → Qualified → FQA spot check → Qualified → Packing → Unqualified → Processing → Check OK Quality creates the future, service first! Tencent Q [1393851952], welcome to guide

捷多邦PCB技术

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