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Integrated Circuit Naming Method (Introduces the Integrated Circuit Naming Method stipulated by Chinese Ministry Standards) [Copy link]

Integrated Circuit Naming Method (Introduces the Integrated Circuit Naming Method stipulated by Chinese Ministry Standards)
The naming method specified in the original departmental standard
X
XXX
X
X
Circuit Type Circuit series and Circuit Specification Symbols Circuit Packaging
T: TTL; Variety serial number (Pinyin letters) A: Ceramic flat;
H: HTTL; (three digits) B: Plastic flat;
E: ECL; C: Ceramic dual in-line socket;
I:IL; D: Plastic dual in-line plug;
P: PMOS; Y: Metal round shell;
N: NMOS; F: Metal rhombus;
F: linear amplifier;
W: integrated voltage regulator;
J: Interface circuit.
Naming method specified in the original national standard
C X XX X X
made in China Device Type Device family and Operating temperature range Device package symbol
T: TTL; Variety code C: (0-70)℃; W: ceramic flat;
H: HTTL; (Device serial number) E: (-40~85)℃; B: Plastic flat;
E: ECL; R: (-55~85)℃; F: Fully sealed flat;
C: CMOS; M: (-55~125)℃; D: Ceramic dual in-line socket;
F: linear amplifier; P: Plastic dual in-line plug;
D: Audio and TV circuits; J: Black porcelain double-thread straight plug;
W: voltage regulator; K: Metal rhombus;
J: Interface circuit; T: metal round shell;
B: Nonlinear circuit;
M: memory;
U: microcomputer circuit;
Among them, the standard series in TTL is the CT1000 series;
H series is CT2000 series;
The S series is the CT3000 series;
LS series is CT4000 series;
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It is beautiful to give a thumbs up to a post, but those who just read it without giving a thumbs up are really ignorant.  Details Published on 2009-11-29 22:35
 

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The naming method specified in the original departmental standard
C
X
XX
X
X
China national standard products Device Type Use Arabic numerals and Operating temperature range Encapsulation
T: TTL circuit; Letters indicate device series C: (0~70)℃ F: Multilayer ceramic flat;
H: HTTL circuit; Column Variety G: (-25~70)℃ B: Plastic flat;
E: ECL circuit; TTL is divided into: L: (-25~85)℃ H: black porcelain flat;
C: CMOS circuit; 54/74XXX; E: (-40~85)℃ D: Multilayer ceramic dual in-line plug-in;
M: memory; 54/74HXXX; R: (-55~85)℃ J: Black porcelain dual in-line plug;
U: microcomputer circuit; 54/74LXXX; M: (-55~125)℃ P: Plastic dual in-line plug;
F: linear amplifier; 54/74SXXX; S: Plastic single in-line plug;
W: voltage regulator; 54/74LSXXX; T: metal round shell;
D: Audio and TV circuits; 54/74ASXXX; K: Metal rhombus;
B: Nonlinear circuit; 54/74ALSXXX; C: Ceramic chip carrier;
J: Interface circuit; 54/FXXX. E: Plastic chip carrier;
AD: A/D converter; CMOS is divided into: G: grid pin grid array;
DA: D/A converter; 4000 series; This manual uses:
SC: dedicated communication circuit; 54/74HCXXX; SOIC: Small lead package (general term);
SS: sensitive circuit; 54/74HCTXXX; PCC: Plastic chip carrier package;
SW: clock circuit; LCC: Ceramic Chip Carrier Package;
SJ: electromechanical instrumentation circuits; W: Ceramic flat.
SF: copier circuit;
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Are you studying electronics?
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I would like to ask if there is any information to find the complete model of the small package IC with some codes printed on it! Thank you
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Is it new?
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Study
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Good stuff, thanks for sharing
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Very good, I collect it
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It is beautiful to give a thumbs up to a post, but those who just read it without giving a thumbs up are really ignorant.
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