【Molex】Case Study | Sentrality Improves Component Flexibility in Data Centers

Driven by the wave of the artificial intelligence era, the demand for data is surging at an unprecedented rate. This growth trend has urgently created the need for next-generation data centers to support high-current solutions.

Challenges faced by customers

Considering the limited space available for data centers and servers, providing more power while further reducing the space has become a major challenge in server power design, which also reflects the demand for high-density power solutions. Improving server power efficiency is not only important for cost savings, but also for responding to challenges caused by limited space. This is a topic that we must work together to solve.

Our customers are facing this challenge. They are working to combine server components and power supplies in a "stackable" manner through high-current board-to-board connectors. However, faced with the very subtle "29.6mm" space gap between stacked components, they found that the standard board-to-board connectors on the market could not fill the space for combining these components, which became a difficult technical bottleneck.

Molex's solution

In the process of seeking a customized high-current board-to-board connection solution, the customer turned to Molex for assistance. We provided a dedicated solution - Sentrality high-power connector. This sandwich-style board-to-board connector is cleverly designed to greatly improve the connection flexibility of board-to-board or board-to-power busbar. In particular, Sentrality has a +/- 1.00 mm floating alignment function that effectively solves design problems when there are special tolerances between stacked boards. This solution is greatly integrated into the server power design, greatly reducing the need for customers to make major design changes.

▲Sentrality pin and socket interconnect system

Features and Benefits of Sentrality Interconnect System

Molex's Sentrality Interconnect System introduces eye-of-the-needle press-fit sockets, mezzanine-style board-to-board and board-to-busbar connectors that are self-aligning without soldering, enhancing design flexibility. High-voltage, high-current board-to-board, busbar-to-board and busbar-to-busbar connectors are available with +/- 1.00mm radial self-aligning capabilities to overcome tolerance stack-up issues.

Low contact resistance

Sentrality Interconnects offer low contact resistance and low voltage drop, resulting in minimal heat generation at the contact interface and higher current carrying capabilities compared to other contact designs.

Self-aligning

Incorporating Molex's proprietary OmniGlide technology, it provides +/- 1.00mm radial self-alignment between the pin and socket during mating.

Free custom pins and sockets

Application specific sockets can be created by repositioning the socket flange anywhere along the length of the housing body along with application specific pin lengths without additional development costs.

Design Flexibility

Sentrality pins and sockets offer a variety of board connection options for use on printed circuit boards or busbars to provide design and manufacturing flexibility.

As data centers pursue faster, more stable, and even more miniaturized functions, the "flexibility" of connectors has become the key. This flexibility not only reduces customization costs, but also has strong performance to meet the needs of various future applications.

As an authorized distributor of Molex, Heilind can provide relevant product services and support to the market. In addition, Heilind also supplies products from many of the world's top manufacturers, covering 25 different component categories. It attaches importance to all market segments and all customers, and constantly seeks a wide range of product supplies to cover all markets.