Development Trends and Prospects of 3D Packaging[Source: "Electronics and Packaging"] [Author: Weng Shousong]1 Why develop 3D packaging? So far, in the field of IC chips, SoC (system-on-chip) is the m
1. When the USB cable is plugged in, the OS will eject the SD card on the PC; when the power cable is plugged in, the OS will only charge. How does the OS distinguish? 2. When the SD card is unmounted
In the process of embedded development, we often encounter the situation that we need to edit various suffix files in IDE , but some files with suffixes may not be opened with the editor we want, so w
Haha, a little personal suggestion! Now more and more people are learning single-chip microcomputers, and EEworld has made a lot of contributions in this regard! ! Single-chip microcomputer learners u