The world’s first, Apple iPhone 15 Pro model is equipped with Micron’s “D1β” LPDDR5 DRAM chip

According to news on September 27, after the industry analysis organization TechInsights disassembled the iPhone 15 Pro, it was discovered that Micron’s latest ultra-high density D1β (D1b) LPDDR5 16 Gb DRAM chip was used internally. This is the industry’s first foray into D1β.

TechInsights stated that the pursuit of smaller, faster, and more efficient components is a continuing driving force in the technology industry, and D1β DRAM is hailed as the most advanced DRAM process node in the world.

After TechInsights dismantled the iPhone 15 Pro, it discovered the DRAM chip model A3101, which uses Micron's revolutionary D1β LPDDR5 16 Gb DRAM chip, code-named Y52P die.

What sets the chip apart is not only its advanced technology but also its smaller physical size. Additionally, it offers a significant increase in density compared to its predecessor, the LPDDR5/5X D1α 16 Gb chip.

Micron bypasses extreme ultraviolet lithography (EUVL) in the production of D1β DRAM chips.

IT Home Note: EUVL is a technology used in DRAM by competitors such as memory manufacturers Samsung and SK Hynix, and is regarded as an important driving factor in shrinking DRAM processes to sub-15nm levels.

Micron has exceeded expectations by successfully developing and manufacturing D1z, D1α and now D1β DRAM chips without using EUVL technology.