The Bluetooth Special Interest Group (SIG) has released the Auracast™ Broadcast Audio Specification , which enables a single audio source Auracast transmitter device to broadcast one or more audio streams to multiple Auracast receiver devices.
CEVA, Inc. (NASDAQ: CEVA), a market leader in wireless connectivity, smart sensing technologies and integrated IP solutions, announced that its latest RivieraWaves Bluetooth 5.3 IP family now supports Auracast™, a new audio sharing standard. Auracast is the Bluetooth LE Audio broadcast specification announced today by the Bluetooth Special Interest Group (SIG). Auracast broadcast audio is designed to revolutionize the shared audio experience, enabling an unlimited number of Auracast receiver-compatible devices (such as TWS earbuds, headphones, hearing aids and wireless speakers) to simultaneously receive audio broadcasts from one or more Auracast transmitter devices.
The Bluetooth Special Interest Group (SIG) recently released its latest market forecast for 2022, predicting that the compound annual growth rate (CAGR) of Bluetooth audio streaming device shipments will reach 7%, reaching 1.8 billion units per year by 2026, when shipments of headphone products will triple. The new Auracast broadcast audio is part of the Bluetooth LE Audio specification and will bring important new innovation opportunities, including enabling personal and location-based audio sharing. Potential use cases include audio broadcasts for specific flights at airports, multilingual options in cinemas or museums, and broadcasting audio content directly to hearing aids to provide a variety of accessibility features for the hearing impaired in public places.
Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at CEVA, commented: "We welcome the launch of the Auracast Broadcast Audio specification, which will transform the way people share audio content in both private and public spaces. CEVA has made outstanding contributions to the evolution of the Bluetooth standard and is proud to license Bluetooth LE and dual-mode technologies, including Auracast solutions, to major semiconductor companies and OEMs for a wide variety of applications including wireless headsets, TWS earbuds, hearing aids, smartwatches, speakers and microphones."
CEVA is a leading provider of Bluetooth platform IP solutions integrated into SoCs, enabling billions of Bluetooth devices to date. CEVA also offers Bluetooth LE and dual-mode IP platforms, including baseband controllers, radios and complete software stacks, compliant with Bluetooth 5.3, LE Audio and Auracast specifications. To further simplify the development of wireless audio devices, CEVA's Bluebud Bluetooth Audio Turnkey Platform provides a complete wireless audio development experience, targeting TWS earbuds, smartwatches, wireless microphones and speaker products. The Bluebud platform combines Bluetooth, audio and sensing IP in a single integrated solution and offers a complete audio codec lineup including LC3, (m)SBC, CVSD, AAC, MP3, as well as voice processing algorithms including ClearVox for noise reduction and echo cancellation, WhisPro for speech recognition and MotionEngine Hear for spatial audio and motion sensing. To learn more about how CEVA is working with customers to help them create the next generation of wireless audio SoC products with best-in-class IP and chip design expertise, please contact info@ceva-dsp.com.
Previous article:iPhone 14 Pro gold version renderings exposed: the most recognizable iPhone
Next article:Xcell Semiconductor's "RF EDA/Filter Design Platform" shines at IMS2022
- Popular Resources
- Popular amplifiers
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- BOE's new generation of light-emitting devices empowers iQOO 13 to fully lead the flexible display industry to a new level of performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- (Repost) Introduction to MOS tubes - only talk about applications, not principles
- What do these three lines in EMC mean?
- How to use the ratiometric characteristics of sensors and ADCs to improve accuracy
- Read and write SD card in Uboot with SIN-IMX6UL development board
- Is it possible to estimate the gain of an antenna in this way?
- Skills required by MCU engineers and embedded engineers
- MSP430 clock system problem
- The more "flirty" serpentine traces on a PCB, the more "advanced" it is?
- Happy Dragon Boat Festival
- Encoder counting principle and motor speed measurement principle - multi-picture analysis