Samsung's chip and foundry executives reshuffle to accelerate 3nm yield rate competition with TSMC

Juheng.com reported today that according to Korean media, Samsung Electronics has replaced the head of the semiconductor R&D center responsible for developing the next generation of chips, and the senior management of the foundry business has also been reshuffled, with storage experts leading the core department of the foundry business. Industry analysts believe that as Samsung is about to take the lead in mass production of 3 nanometers, it has been repeatedly reported that the poor yield rate of Samsung's advanced process is the biggest problem. This drastic reshuffle of senior management is to accelerate the improvement of the yield rate of advanced processes to compete with TSMC.

Samsung Electronics has appointed Song Jae-hyuk, vice president and head of the Flash development department, as the new head of the semiconductor R&D center. In the foundry business, Nam Seok-woo, vice president of global manufacturing and infrastructure of the semiconductor equipment solutions department, was appointed as the head of the foundry manufacturing technology center. It is reported that both of them are experts in the development of Samsung's memory process technology. Samsung also appointed Kim Hong-shik, vice president of the memory manufacturing technology center, to lead the foundry technology innovation team.

According to reports, Samsung plans to start mass production of 3nm process as early as this month (June), surpassing TSMC, which plans to start mass production of 3nm process in the second half of the year.