On May 11, Yibin District of Luoyang City, Luoyang Manufacturing High-quality Development Fund and Shengshijing Asset Management Group Co., Ltd. signed an agreement to jointly initiate the establishment of the Yibin District Manufacturing High-quality Development Fund with a total scale of 1 billion yuan and an initial scale of 200 million yuan.
News from Yibin today showed that the fund will focus on investing in smart manufacturing fields such as semiconductors, artificial intelligence, robots, and precision equipment in the Yibin area, and continue to strengthen emerging industries such as smart manufacturing in Luoyang. The first batch of four planned investment projects have been signed and implemented.
It is reported that Yibin Economic Development Zone is one of the three major sections of Luoyang’s central urban area. In the future, Yibin Economic Development Zone will focus on the positioning of a new science and technology industrial city.
The "Luoyang Digital Transformation Action Plan" proposes to make breakthroughs and upgrade the core industries of electronic information manufacturing. By 2025, an important optoelectronic device production base in the central region will be built, and the main business income of the smart sensor industry chain will be driven to 5 billion yuan, and the scale of the semiconductor materials industry will reach 10 billion yuan.
Previous article：Hexin Technology completes strategic financing and focuses on the development of domestic server chips
Next article：Google releases TPU v4 cluster, with E-level computing power to support artificial intelligence development
Recommended ReadingLatest update time:2024-11-15 15:18
- Popular Resources
- Popular amplifiers
-
Optimized drivetrain and new semiconductor technologies enable the design of energy-efficient electr - VLSI Physical Design: From Graph Partitioning to Timing Closure
- Chip Manufacturing: A Practical Tutorial on Semiconductor Process Technology (Sixth Edition)
- Fundamentals of Power Semiconductor Devices (B. Jayant Baliga)
Optimized drivetrain and new semiconductor technologies enable the design of energy-efficient electr
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claimsAccording to foreign media reports, recently, the British consumer rights organization "Which?" filed an antitrust lawsuit against Apple on behalf of approximately 40 million iCloud users, accusing Apple of violating competition laws and seeking up to $30 million in damages. ...
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thickerOn November 11, sources Jukanlosreve and yeux1122 revealed that both Apple and Samsung's ultra-thin high-density battery projects had failed. The two companies had previously tried to develop ultra-thin high-density batteries in their iPhones. ...
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable developmentAt this year's CIIE, Micron shared the latest progress of the Xi'an packaging and testing plant expansion project, and shared with relevant partners on the theme of "Talking about Empowerment: Co-promoting Coexistence of Business and Sustainable Development"....
- Qorvo: Innovative technologies lead the next generation of mobile industryAt the 12th China Hard Technology Industry Chain Innovation Trend Summit held recently, Qorvo China Senior Sales Director Jiang Xiong shared Qorvo's technological innovation and market development in the new generation of 5G applications. ...
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screenBOE (BOE Oriental) exclusively supplies Nubia and Red Magic flagship new products. The new generation of under-screen display technology leads the industry into the era of true full-screen. On November 5, BOE (BOE Oriental) joined hands with Nubia, ...
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Learn ARM development(14)
- Learn ARM development(15)
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Qiming Cloud Sharing | What are the differences between Espressif's newly released ESP32-C2 and the ESP32-C3 that went into mass production in May this year?
- TrueStudio flashes STM32 project and prompts Verify failed, and now I am helpless
- Dynamic Near Field Communication (NFC) Type 4B Tag
- [GD32E231 Work Submission] Environmental Radiation Dose Monitoring Equipment Design
- [RVB2601 Creative Application Development] 7. IoT Control
- DM6446 DSP end program optimization
- Op amp second order filter circuit
- MPXV2202DP connected to IN132 output abnormality, I don't know how to deal with it
- A beautiful frame diagram
- CES 2021 Complement Event Activity Recognition on IMU with Machine Learning Core
京公网安备 11010802033920号