GP-HPU, copper clad laminate and other projects gather core strength, the sixth preliminary round is coming

Publisher:古古斋Latest update time:2022-04-11 Source: 爱集微 Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

Since the 2022 "Core Power" competition "Looking for good Chinese projects and gathering Chinese core power" was officially launched in March, many high-quality projects have been gathered. After the first five preliminary rounds were well received, the sixth round will also be launched on April 13, and projects from four tracks including GP-HPU, copper clad laminate, semiconductor test equipment and multi-threaded processor will meet with everyone.

This preliminary round will be held in the form of an online meeting, and three institutional guests will be invited to comment. After the roadshow, the jury will score the projects, and the final projects will be selected based on the jury's scoring results of each roadshow.

In 2022, the "Core Power" competition will be further upgraded. Different from the self-registration in previous years, the competition will adopt the [institutional recommendation system] for the first time, and the jury will also introduce more executives of listed companies. Currently, the first list of the jury has reached 50 people, and it will bring a lot of rights and interests such as media exposure, investment and financing services, and industry resource docking to all participating projects.

The sixth round of the 2022 "Core Power" preliminary round will focus on the following popular tracks:

1. GP-HPU: With the continuous maturity of technology and the advancement of chiplets, it has become possible to integrate more processor engines on a single chip, and the Hyper-heterogeneous Processing Unit (HPU) has also begun to "come into reality". Compared with traditional CPUs and GPUs, HPU can achieve a significant performance improvement, and it is an emerging market with broad prospects in the future.

2. Copper clad laminate: Copper clad laminate is the full name of copper clad laminate, which is the basic material of the electronics industry and the main material for processing and manufacturing printed circuit boards. The advent of the 5G era and the rise of electronic terminals such as automotive electronics and green base stations will drive the demand for copper clad laminates. According to forecasts by Market Watch and other institutions, the global copper clad laminate industry output value is expected to grow to US$14 billion by 2026 at a compound annual growth rate of 1.42%.

3. Semiconductor test equipment: Test equipment is mainly used to detect the performance and defects in the semiconductor manufacturing process, and it runs through almost the entire chip manufacturing process. As chip design becomes more complex, the importance of test equipment is becoming increasingly prominent. However, in this market, there is a monopoly by international leaders such as Advantest and Teradyne, and a group of excellent semiconductor test equipment manufacturers are urgently needed.

4. Multi-threaded processor: Multi-threading can improve the utilization rate of the CPU. With the further development of AI, automotive electronics, industrial control and other applications in the future, the requirements for the CPU will also increase. High real-time and multi-concurrency multi-threaded processors will definitely have a broad market and be suitable for various application scenarios.

Click here to sign up for the 2022 "Core Power" preliminary round!

Participating Project

The four major projects participating in this roadshow will show their strengths. They are:

【Project 1】General Purpose Hyper-Heterogeneous Processor GP-HPU

Company Name: Shanghai Juxiang Technology Co., Ltd.

Roadshow speaker: Huang Chaobo, founder & CEO

Shanghai Juxiang Technology Co., Ltd. was established in July 2021. The founding team comes from top international chip giants and well-known domestic Internet cloud computing companies.

Hyper-heterogeneous processor HPU: Integrates various accelerations such as network, storage, virtualization, security, trusted computing, video imaging, and artificial intelligence, and integrates into cloud computing services to become a comprehensive computing power platform; based on the software and hardware fusion architecture, GP-HPU is developed, and related technologies can form more than 100 core invention patents; compared with the current CPU, GPU, and DPU architecture processors, the computing power can be increased by 1-2 orders of magnitude; it can be widely used in ultra-high computing power scenarios such as cloud data centers, edge data centers, and autonomous driving.

The team has rich experience in both parties, deeply understands and exceeds user needs; the product has been recognized by mainstream customers and has reached a preliminary intention. Currently, support for network programmable smart network cards has been completed; 20% of the design of the GP-HPU chip under development has been completed, and it is expected to be available for user testing in 18 months.

Juxiang Technology believes that as the digital economy gradually deepens, the demand for computing power continues to increase. We are relatively backward in the fields of CPU, GPU and DPU, and HPU is still a very new thing. An independent and original innovative HPU is needed to build a safe and reliable computing power system. We must turn passivity into initiative and seize the high ground of technology.


Reference address:GP-HPU, copper clad laminate and other projects gather core strength, the sixth preliminary round is coming

Previous article:Knometa: The top five companies will account for 56% of the global wafer production capacity in 2021, with Samsung ranking first
Next article:Weige Technology was listed on the Shanghai Stock Exchange Science and Technology Innovation Board on April 12

Latest Mobile phone portable Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号