Canon's 3D semiconductor lithography machine will be available as early as the first half of 2023

On April 1, according to a report by Nikkei Chinese, Canon is developing a lithography machine for semiconductor 3D technology, and Canon's new lithography machine will be available as early as the first half of 2023. The exposure area is expanded to about 4 times that of existing products, which can support the production of large semiconductors used in AI.

It is reported that 3D technology is a way to improve performance by stacking multiple semiconductor chips and connecting them closely. On the plate-shaped parts where the chips are placed, multi-layer fine wiring that electrically connects each chip is formed at a high density, and Canon is developing a new lithography machine for forming such wiring.

In addition, the new lithography machine improves exposure accuracy by improving optical components such as lenses and stages on the original basis; it increases wiring density by improving resolution and also supports a line width of 1 micron.