With RMB 365 million of financing completed, Bolant accelerates the layout of third-generation semiconductor materials

According to news from Zhejiang Financial Holding in early March, Jinhua Jintou completed the capital increase of Zhejiang Bolant Semiconductor Technology Co., Ltd. (hereinafter referred to as "Bolant"). The investment institutions in this round of financing include China North Industries Group Corporation's China National Fund for National Development, Jinhua Shuanglong Talent Fund and Development Zone Jinkai Industry Leading Investment Fund, with a total financing scale of 365 million yuan.

After completing this round of financing, Bolant will further increase its R&D investment and accelerate the layout of third-generation semiconductor materials on the basis of consolidating its advantages in patterned substrates.

It should be pointed out that in February this year, Bolant received investment from China National Defense Technology Co., Ltd. At that time, China National Defense Technology Co., Ltd. reported that after this round of financing, Bolant will set up a subsidiary in Xiamen Torch High-tech Zone (currently completed industrial and commercial registration), build a third-generation semiconductor R&D center and add MEMS industrialization packaging lines and other businesses.

According to Bolant’s official website, the company was founded in 2012. It adopts internationally leading optical and semiconductor preparation process technologies and utilizes advanced new semiconductor material processing equipment. It is mainly committed to the research and development and industrialization of GaN-based LED chip (patterned) substrates and third-generation semiconductor materials. It has now developed into one of the top three production-scale enterprises in the domestic industry segment.