Kunshan: AUO's low-temperature polysilicon project starts

On February 8, the Suzhou Electronic Information Industry Innovation Cluster Construction Promotion Conference and the AUO Low-Temperature Polysilicon Project Launch Ceremony were held in Kunshan. The electronic information industry became the first industry in Suzhou with an annual output value of over 1 trillion yuan.

At the meeting, 150 major projects with a total investment of 129 billion yuan were signed and started. Among them, Tongxingda Semiconductor and Pronow Electronics signed contracts to settle in Kunshan.

It is reported that the total investment of Tongxingda Semiconductor Advanced Packaging Project is expected to be 3 billion yuan, and the output value is expected to be 3.2 billion after reaching full production. Shenzhen Tongxingda Technology Co., Ltd. is a listed company on the Shenzhen Main Board. It mainly develops and produces LCD liquid crystal display modules and camera display modules. It plans to invest in the construction of a GoldBump packaging and testing factory for advanced packaging technology in Qiandeng, Kunshan. The products are used in integrated circuit packaging technology and external connection of optoelectronic components.

The Pronovo high-density interconnect substrate (mSAP) project has a total investment of 1.3 billion yuan. Jiangsu Pronovo Electronics Co., Ltd. was established in 2004 and is mainly engaged in the production and service of integrated circuit packaging substrates such as 5G, Internet of Things, and new energy vehicle chips.

In addition, it is reported that AU Optronics (Kunshan) Co., Ltd. achieved a production value of 6.95 billion yuan in 2021, a year-on-year increase of 49.5%. The capital increase of 1.8 billion US dollars will be used to upgrade production lines and expand production capacity. After the new project reaches full production, the company's annual output value will exceed 10 billion yuan.