Anjie Technology: Layout of chemical mechanical polishing liquid and functional wet electronic chemicals

On January 28, an investor asked Anjie Technology on an interactive platform whether the company's existing production capacity can meet customer needs and whether the company has plans to respond to Intergration's recent acquisition of Cabot in an attempt to expand its share in the semiconductor materials market.

Anji Technology responded that the company's current production capacity is relatively sufficient, and the company has completed the layout of new production lines for chemical mechanical polishing liquids and functional wet electronic chemicals, and is actively building them. Anji will continue to focus on the company's core technology, increase R&D investment, and while continuing to expand existing products horizontally, strengthen the promotion of independent control of upstream raw materials in the vertical industry chain and the expansion and extension of adjacent fields.

Previously, Anjie Group also explained on the investor platform that the company's chemical mechanical polishing liquid products include silicon/polysilicon polishing liquid, shallow trench isolation (STI) polishing liquid, dielectric material (silicon dioxide, silicon nitride) polishing liquid, tungsten polishing liquid, copper and copper barrier layer polishing liquid, three-dimensional integration (TSV, hybrid bonding, etc.) polishing liquid and polishing liquid used in third-generation broadband semiconductors. The types and proportions of abrasive particles used in different series of polishing liquids are different.

It is reported that in terms of copper and copper barrier layer polishing liquid, Anjie Technology not only continues to optimize the performance and stability of products at the 14nm technology node and above that have been mass-produced, but also works closely with customers to test and optimize at technology nodes below 14nm (including 10-7nm). At the same time, the company has gradually improved the tungsten polishing liquid product platform. The new tungsten polishing liquid product has been demonstrated in the DRAM field and analog chip field, and is in mass production and sales. Breakthroughs have also been achieved in the field of dielectric material polishing liquid, and important progress has been made in cerium dioxide-based polishing liquid products.

Wang Shumin, Chairman and CEO of Anjiewei, previously stated that "the company's chemical mechanical polishing liquid products are closely related to the post-polishing cleaning liquid products. The post-polishing cleaning liquid itself is used to clean the materials thrown off the wafer and the residual polishing liquid. The company has a comprehensive understanding and familiarity with the composition of the polishing liquid and the mechanism of the polishing process, and has unique advantages in the research and development and production of post-polishing cleaning liquid products."