On December 16, 2021, MediaTek released the Dimensity 9000 flagship 5G mobile platform, the first flagship chip in the industry to adopt TSMC's 4nm process. At a time when the "chip shortage" problem continues to plague the industry, MediaTek has taken this opportunity to launch an impact on the high-end chip market.
Xu Jingquan (live broadcast screenshot)
At the press conference, Xu Jingquan, Vice President of MediaTek and General Manager of Wireless Communications Division, revealed that in 2021, MediaTek's share of the global mobile phone chip market has reached 40%, "two out of every five mobile phones are equipped with MediaTek chips." However, as the market share continues to rise, the problem that MediaTek urgently needs to solve is how to enter the high-end market. Historically, MediaTek has made several attempts to enter the high-end market, but with limited success.
The "chip shortage" crisis caused by the restrictions on Huawei's Kirin chips and the epidemic has given MediaTek a new opportunity to enter the high-end market. MediaTek's "stacked materials" on the world's first 4nm process chip also reflects the company's attention to it. The Dimensity 9000's CPU uses the new generation of Armv9 architecture, including 1 super-large core with a main frequency of up to 3.05GHz, 3 large cores and 4 energy-efficient cores, a total of ten cores. It also supports LPDDR5X memory and dual-channel UFS3.1 flash memory.
MediaTek also announced at the press conference that terminals using the Dimensity 9000 flagship 5G mobile platform are expected to be available in the first quarter of 2022. Duan Yaohui, vice president of OPPO and president of the mobile phone product line, also revealed that OPPO's next-generation Find X flagship series will be the first to be equipped with the Dimensity 9000 flagship platform. Executives of manufacturers such as vivo, Xiaomi, and Honor also announced that they will use this chip in new models released in 2022.
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